MCP1700 Microchip Technology, MCP1700 Datasheet - Page 16

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MCP1700

Manufacturer Part Number
MCP1700
Description
Low Quiescent Current LDO
Manufacturer
Microchip Technology
Datasheet

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MCP1700
DS21826B-page 16
3-Lead Plastic Small Outline Transistor (TT or NB) [SOT-23]
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
A1
A
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Lead Pitch
Outside Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
1
e
N
e1
b
D
2
Dimension Limits
E1
A2
E
Units
A2
A1
E1
e1
N
A
E
D
e
L
φ
c
b
c
0.89
0.79
0.01
2.10
1.16
2.67
0.13
0.08
0.30
MIN
MILLIMETERS
0.95 BSC
1.90 BSC
NOM
0.95
1.30
2.90
0.50
Microchip Technology Drawing C04-104B
3
© 2007 Microchip Technology Inc.
MAX
1.12
0.10
0.60
0.54
1.02
2.64
1.40
3.05
0.20
10°
L
φ

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