MCP1700-5002E/TT Microchip Technology, MCP1700-5002E/TT Datasheet - Page 4

• Manufacturer Part Number: MCP1700-5002E/TT
• Description: Low Quiescent Current LDO
• Manufacturer: Microchip Technology

MCP1700
DC CHARACTERISTICS (CONTINUED)
TEMPERATURE SPECIFICATIONS
DS21826A-page 4
Electrical Characteristics: Unless otherwise specified, all limits are established for V
(X5R), C
Boldface type applies for junction temperatures, T
Output Noise
Power Supply Ripple
Rejection Ratio
Thermal Shutdown Protection
Note 1:
Electrical Characteristics: Unless otherwise specified, all limits are established for V
C
Boldface type applies for junction temperatures, T
Temperature Ranges
Specified Temperature Range
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistance
Thermal Resistance, SOT23-A
Thermal Resistance, SOT89
Thermal Resistance, TO-92
OUT
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
= 1 µF (X5R), C
2:
3:
4:
5:
6:
7:
IN
Parameters
= 1 µF (X5R), T
The minimum V
V
input voltage (V
TCV
temperature range. V
Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output
voltage due to heating effects are determined using thermal regulation specification TCV
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured
value with a V
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air (i.e., T
dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained
junction temperatures above 150°C can impact the device reliability.
The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the
ambient temperature is not significant.
temperature and the thermal resistance from junction to air (i.e., T
dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained
junction temperatures above 150°C can impact the device reliability.
R
Parameters
is the nominal regulator output voltage. For example: V
OUT
= (V
IN
= 1 µF (X5R), T
OUT-HIGH
R
A
IN
IN
+ 1V differential applied.
= +25°C.
= V
must meet two conditions: V
R
OUT-LOW
- V
PSRR
+ 1.0V); I
Sym
T
e
SD
OUT-LOW
N
A
= +25°C.
= lowest voltage measured over the temperature range.
OUT
Sym
) *10
T
T
T
JA
JA
JA
A
A
A
= 100 µA.
Min
J
J
—
—
—
6
(Note 6) of -40°C to +125°C.
(Note 1) of -40°C to +125°C.
/ (V
R
Min
-40
-40
-65
—
—
—
—
* Temperature), V
IN
Typ
140
44
3
2.3V and V
131.9
Typ
335
230
52
R
Max
—
—
—
= 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, 5.0V. The
IN
+125
+125
+150
Max
OUT-HIGH
—
—
—
—
A
A
, T
, T
V
µV/(Hz)
R
J
J
,
Units
,
+ 3.0%
dB
°C
JA
Units
JA
°C/W
°C/W
°C/W
°C/W
IN
IN
). Exceeding the maximum allowable power
°C
°C
°C
= highest voltage measured over the
). Exceeding the maximum allowable power
= V
1/2
= V
R
R
V
I
f = 100 Hz, C
V
V
V
Minimum Trace Width Single Layer
Board
Typical FR4 4-layer Application
Typical, 1 square inch of copper
EIA/JEDEC JESD51-751-7
4-Layer Board
L
+ 1, I
+ 1, I
DROPOUT
INAC
R
IN
= 100 mA, f = 1 kHz, C
= 1.2V
= V
LOAD
LOAD
= 100 mV pk-pk, C
2003 Microchip Technology Inc.
R
OUT
+ 1, I
.
.
= 100 µA, C
= 100 µA,
Conditions
OUT
Conditions
L
= 100 µA
= 1 µF, I
OUT
OUT
IN
L
= 50 mA,
= 0 µF,
= 1 µF
= 1 µF