MCP606 Microchip Technology, MCP606 Datasheet - Page 23

• Manufacturer Part Number: MCP606
• Description: 2.5V to 5.5V Micropower CMOS Op Amps
• Manufacturer: Microchip Technology

8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
2000 Microchip Technology Inc.
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-086
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
c
B
p
n
Dimension Limits
E1
E
Units
A2
E1
A1
D
n
p
A
E
L
c
B
MIN
.033
.002
.246
.169
.114
.020
.004
.007
0
0
0
INCHES
NOM
2
1
.026
.035
.004
.173
.118
.024
.006
.010
.251
MCP606/607/608/609
8
4
5
5
D
L
MAX
.043
.037
.006
.256
.177
.028
.008
.122
.012
10
10
A1
8
A
MIN
0.85
0.05
6.25
4.30
2.90
0.50
0.09
0.19
0
0
0
MILLIMETERS*
NOM
0.65
0.90
0.10
6.38
4.40
3.00
0.60
0.15
0.25
8
4
5
5
A2
MAX
DS11177B-page 23
1.10
0.95
0.15
6.50
4.50
3.10
0.70
0.20
0.30
10
10
8