NCP1835 ON Semiconductor, NCP1835 Datasheet - Page 13

• Manufacturer Part Number: NCP1835
• Description: Integrated Li-Ion Charger
• Manufacturer: ON Semiconductor

PCB Layout Recommendations
package is included on the Package Dimension page. It is
critical that the exposed metal pad is properly soldered to
the ground copper area and then connected to a ground
plane through thermal vias. The maximum recommended
thermal via diameter is 12 mils (0.305 mm). Limited by the
size of the pad, six thermal vias should allow for proper
thermal regulation without sacrificing too much copper
area within the pad. The copper pad is the primary heatsink
and should be connected to as much top layer metal as
possible to minimize the thermal impedance. Figure 20
illustrates graphically the recommended connection for the
exposed pad with vias.
The following is a NCP1835 Demo Board Schematic, Layout, and suggested Bill of Materials.
V
(T8)
GND
CC
(T9)
The recommended footprint for the 3x3 mm DFN
C5
FAULT
(T5)
CFLG
(T6)
R4
D1
R5
D2
TIMER
(T10)
C4
Figure 21. Demo Board Schematic
FAULT
CFLG
TIMER
GND
VCC
VCC
NCP1835
http://onsemi.com
VSNS
V2P8
ISEL
NCP1835
BAT
R3
EN
13
JP2
C3
Figure 20. Recommended Footprint
R8
D3
V2P8
(T4)
GND
R2
R9
JP1
C1
R1
C2
+
−
Li−Ion
Battery
V
(T1)
VSNS
(T7)
BAT
GND
(T2)