NCP563 ON Semiconductor, NCP563 Datasheet
NCP563
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NCP563 Summary of contents
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... Gnd Enable Input V C1 This device contains 28 active transistors Figure 1. NCP562 Typical Application Diagram Gnd Input V C1 This device contains 28 active transistors Figure 2. NCP563 Typical Application Diagram Semiconductor Components Industries, LLC, 2002 May, 2002 – Rev OFF Output V in out C2 N/C ...
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... Storage Temperature 1. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per MIL–STD–883, Method 3015 Machine Model Method 200 V 2. Latch up capability (85 C) "100 mA DC with trigger voltage. NCP562, NCP563 Description Symbol V in ...
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... Output Voltage Temperature Coefficient 3. Maximum package power dissipation limits must be observed. T J(max qJA 4. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. NCP562, NCP563 = 1.0 mF 1.0 mF unless otherwise noted.) out J Symbol ...
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... T, TEMPERATURE ( C) Figure 5. Output Voltage versus Temperature 300 V = 3.0 V OUT(nom) 250 200 150 100 50 0 –50 – TEMPERATURE ( C) Figure 7. Dropout Voltage versus Temperature NCP562, NCP563 3 2 3.0 V OUT 2 1 100 0 1 Figure 4. Quiescent Current versus Input 3 OUT ...
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... –30 400 200 OUT –200 V = 3.0 V OUT –400 0 100 200 300 400 500 600 t, TIME (ms) Figure 11. Load Transient Response NCP562, NCP563 –30 1 0.5 0 –0.5 –1 400 450 500 0 50 100 Figure 10. Load Transient Response 3 2.5 2 1.5 1 0.5 0 ...
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... IC operation, bias, etc. When the LDO becomes loaded, this term is called the Ground current actually the difference between the input current (measured through the LDO input pin) and the output current. NCP562, NCP563 DEFINITIONS Line Regulation The change in output voltage for a change in input voltage. ...
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... If junction temperature is not allowed above the maximum 125 C, then the NCP562 and NCP563 can dissipate up to 250 The power dissipated by the NCP562 and NCP563 can be calculated from the following equation: P tot + [ gnd (I out ) ] ) [ out ] * I out output current is needed then the ground current from the data sheet is 2 ...
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... Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection NCP562, NCP563 interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. SC– ...
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... Output Voltage Device NCP562SQ15T1 NCP562SQ18T1 NCP562SQ25T1 NCP562SQ27T1 NCP562SQ28T1 NCP562SQ30T1 NCP562SQ33T1 NCP562SQ50T1 NCP563SQ15T1 NCP563SQ18T1 NCP563SQ25T1 NCP563SQ27T1 NCP563SQ28T1 NCP563SQ30T1 NCP563SQ33T1 NCP563SQ50T1 Additional voltages are available upon request by contacting your ON Semiconductor representative. NCP562, NCP563 ORDERING INFORMATION Marking LDI 1.5 1.8 LEY 2.5 LDK 2.7 LEZ 2.8 LDL 3.0 LDM 3.3 LDN 5.0 LDP 1 ...
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... PACKAGE DIMENSIONS NCP562, NCP563 SC82–AB (SC70–4) SQ SUFFIX CASE 419C–01 ISSUE A K http://onsemi.com 10 ...
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... Notes NCP562, NCP563 http://onsemi.com 11 ...
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... Fax: 303–675–2176 or 800–344–3867 Toll Free USA/Canada Email: ONlit@hibbertco.com N. American Technical Support: 800–282–9855 Toll Free USA/Canada NCP562, NCP563 JAPAN: ON Semiconductor, Japan Customer Focus Center 4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031 Phone: 81–3–5740–2700 Email: r14525@onsemi ...