MC33886 Motorola, MC33886 Datasheet - Page 4

• Manufacturer Part Number: MC33886
• Description: 5.0 A H BRIDGE
• Manufacturer: Motorola

33886
4
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Notes
Supply Voltage
Input Voltage (Note 1)
FS Status Output (Note 2)
Continuous Current (Note 3)
ESD Voltage for DH Package
ESD Voltage for VW Package
Storage Temperature
Ambient Operating Temperature (Note 7)
Operating Junction Temperature
Terminal Soldering Temperature (Note 8)
Approximate Junction-to-Board Thermal Resistance (and Package
Dissipation = 6.0 W) (Note 9)
1.
2.
3.
4.
5.
6.
7.
8.
9.
Human Body Model (Note 4)
Machine Model (Note 5)
Human Body Model (Note 4)
Machine Model (Note 5)
DH Suffix
VW (Pb-Free Suffix)
Exceeding the input voltage on IN1, IN2, D1, or D2 may cause a malfunction or permanent damage to the device.
Exceeding the pull-up resistor voltage on the open drain FS terminal may cause permanent damage to the device.
Continuous current capability so long as junction temperature is ≤ 150
ESD1 testing is performed in accordance with the Human Body Model (C
ESD2 testing is performed in accordance with the Machine Model (C
All terminals are capable of Human Body Model ESD voltages of ±2000 V with two exceptions pertaining only to the DH suffix package:
(1) D2 to PGND is capable of ±1500 V and (2) OUT1 to AGND is capable of ±1000 V.
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heatsinking.
Terminal soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Exposed heatsink pad plus the power and ground terminals comprise the main heat conduction paths. The actual R
values will vary depending on solder thickness and composition and copper trace.
Rating
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
ZAP
°
C.
= 200 pF, R
ZAP
T
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
Symbol
V
V
V
V
SOLDER
T
R
I
V
V
OUT
ESD1
ESD2
ESD1
ESD2
V+
STG
T
T
= 100 pF, R
θ
IN
FS
A
J
JB
ZAP
= 0 Ω).
ZAP
= 1500 Ω).
±2000 (Note 6)
-0.1 to 7.0
-65 to 150
-40 to 125
-40 to 150
±2000
Value
±200
±200
~5.0
220
260
7.0
5.0
40
θ
JB
(junction-to-PC board)
°C/W
Unit
°C
°C
°C
°C
V
V
V
A
V
V