MA4BPS101 Tyco, MA4BPS101 Datasheet

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MA4BPS101

Manufacturer Part Number
MA4BPS101
Description
PIN Diode Chips with Offset Bond Pads
Manufacturer
Tyco
Datasheet
1.MA4BPS101.pdf (4 pages)

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Bonase Electronics (HK) Co., Limited Bonase Electronics (HK) Co., Limited
Part Number:
MA4BPS101
Manufacturer:
TST
Quantity:
5 000
Company:
Meier Automation Equipment Co., Limited Meier Automation Equipment Co., Limited
Part Number:
MA4BPS101
Manufacturer:
MA/COM
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PIN Diode Chips With Offset Bond Pads
Features
Description
These
M/A-COM’s patented HMIC™ process. They contain a single
shunt silicon PIN diode embedded in a glass substrate with dual
75 x 150 micron bond pads located near the chip edges. The large
pads allow use of multiple bond wires. The location of these pads
on a glass substrate results in low parasitic capacitance. The
diode junction is passivated with silicon nitride and a layer of
polyimide has been added for scratch protection during assembly.
The devices are available on industry standard tape frame for
automatic insertion and assembly in high volume applications.
Applications
These diodes are designed for use as general PIN elements in
switches and switched pad attenuators. The chips can handle up
to 10 watts of RF power, and are well suited for use in T/R
switches for subscriber phones, particularly the higher power and
higher frequency systems for satellite based systems. They are
also useful for the switching element in phased array radar appli-
cations. The larger bond pad allows for two (2) 1 mil dia contact
wires which reduces the bond wire inductance almost in half.
M/A-COM Division of AMP Incorporated Q North America: Tel. (800) 366-2266, Fax (800) 618-8883 Q Asia/Pacific: Tel.+85 2 2111 8088, Fax +85 2 2111 8087
Q Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
www.macom.com
1. Guaranteed by correlation to 2 MHz on-wafer measurements.
2. Tested on a sample basis only.
Electrical Specifications @ +25°C
Total Capacitance
Series Resistance
Parallel Resistance
Breakdown Voltage
Carrier Lifetime
Thermal Impedance
Bond Pads Removed From Active Junction
Large Bond Pads Support Multiple Bond Wires
Rugged Silicon-Glass Construction
Silicon Nitride Passivation
Polyimide Scratch Protection
Parameters
silicon - glass
PIN Diode Chips with
Offset Bond Pads
2
1
2
2
AMP and Connecting at a Higher Level are trademarks.
Specifications subject to change without notice.
PIN diode chips are fabricated with
Symbol
Rs
Rp
Vb
C
T
jc
L
T
Units
Volts
K
C/W
pF
nS
-5 Volts at 1 MHz
+10 mA at 1 GHz
Test Conditions
0 Volts at 1 GHz
1A/.01A, 10 mS
+10mA/-6mA
-10 uA
Min.
70
MA4BPS101, MA4BPS201, MA4BPS301
MA4BPS101
Chip Layout
Absolute Maximum Rating
Operating Temperature
Storage Temperature
Forward Current
Reverse Voltage
Incident RF Power
Mounting Temperature
1. Exceeding these limits may cause permanent damage.
Typ.
0.13
110
300
1.9
14
38
Max.
0.17
2.4
Parameter
MA4BPS101, MA4BPS201, MA4BPS301
Min.
70
MA4BPS201
Typ.
0.20
110
300
1.0
28
6
Max.
0.25
1.3
+320 C for 10 seconds
Absolute Maximum
1
-60 C to +150 C
-65 C to +175 C
+40 dBm (CW)
Min.
70
100mA
MA4BPS301
70 V
Typ.
0.30
110
300
0.9
24
6
Max.
0.35
1.2
V2.01

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MA4BPS101 Summary of contents

Page 1

... M/A-COM Division of AMP Incorporated Q North America: Tel. (800) 366-2266, Fax (800) 618-8883 Q Asia/Pacific: Tel.+85 2 2111 8088, Fax +85 2 2111 8087 Q Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020 www.macom.com AMP and Connecting at a Higher Level are trademarks. Specifications subject to change without notice. MA4BPS101, MA4BPS201, MA4BPS301 Chip Layout Absolute Maximum Rating Parameter Operating Temperature ...

Page 2

... Notes: 1. Bond pad material: 2.5 micron thick gold. 2. Shaded areas indicate wire bonding pads 3. Backside metal: 0.1 micron thick gold. Parallel Resistance vs. Reverse Voltage at 1 GHz 100,000 10,000 1,000 0.0 10.0 100.0 MA4BPS101, MA4BPS201, MA4BPS301 INCHES MILLIMETERS MIN MAX MIN 0.019 0.0213 0.480 0.019 0.0213 ...

Page 3

... Q Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020 www.macom.com AMP and Connecting at a Higher Level are trademarks. Specifications subject to change without notice. Ls Conditions Cp Units MA4BPS101 MA4BPS201 MA4BPS301 Ls Conditions Cp Rp Units MA4BPS101 MA4BPS201 MA4BPS301 MA4BPS101, MA4BPS201, MA4BPS301 10mA @ 1 GHz Ohms pF nH 1.9 0.03 0.05 1.0 0.03 0.05 0.9 0.03 0.05 Cj ...

Page 4

... M/A-COM Division of AMP Incorporated Q North America: Tel. (800) 366-2266, Fax (800) 618-8883 Q Asia/Pacific: Tel.+85 2 2111 8088, Fax +85 2 2111 8087 Q Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020 www.macom.com AMP and Connecting at a Higher Level are trademarks. Specifications subject to change without notice. MA4BPS101, MA4BPS201, MA4BPS301 V2.01 ...

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