LM4867MT National Semiconductor, LM4867MT Datasheet - Page 5

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LM4867MT

Manufacturer Part Number
LM4867MT
Description
Output-Transient-Free Dual 2.1W Audio Amplifier Plus No Coupling Capacitor Stereo Headphone Function
Manufacturer
National Semiconductor
Datasheets

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Electrical Characteristics for Single-Ended Operation
Note 20: See Application Information section ’Single-Ended Output Power Performance and Measurement Considerations’ for more information.
Typical Performance Characteristics
MTE- and LQ- Specific Characteristics
LM4867MTE
THD+N vs Output Power
LM4867LQ
THD+N vs Frequency
LM4867LQ, LM4867MTE
Power Dissipation vs Power Output
Note 21: This curve shows the LM4867MTE’s thermal dissipation ability at different ambient temperatures given these conditions:
it. Board information - copper dimensions: 74x74mm, copper coverage: 100% (buried layer) and 12% (top/bottom layers), 16 vias under the exposed-DAP.
500LFPM + JEDEC board: The part is soldered to a 1S2P 20-lead exposed-DAP TSSOP test board with 500 linear feet per minute of forced-air flow across
500LFPM + 2.5in
2.5in
Not Attached: The part is not soldered down and is not forced-air cooled.
2
: The part is soldered to a 2.5in
2
: The part is soldered to a 2.5in
DS200013-33
DS200013-61
DS200013-54
2
, 1oz. copper plane.
2
, 1 oz. copper plane with 500 linear feet per minute of forced-air flow across it.
LM4867MTE
THD+N vs Frequency
LM4867MTE
THD+N vs Output Power
LM4867LQ, LM4867MTE(Note 21)
Power Derating Curve
5
DS200013-59
DS200013-36
DS200013-34
LM4867LQ
THD+N vs Output Power
LM4867LQ
THD+N vs Output Power
(Notes 3, 13) (Continued)
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DS200013-53
DS200013-55

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