JANSH2N7261 International Rectifier, JANSH2N7261 Datasheet

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JANSH2N7261

Manufacturer Part Number
JANSH2N7261
Description
REPETITIVE AVALANCHE AND dv/dt RATED HEXFET TRANSISTOR
Manufacturer
International Rectifier
Datasheet
REPETITIVE AVALANCHE AND dv/dt RATED
HEXFET
100Volt, 0.18 , MEGA RAD HARD HEXFET
International Rectifier’s RAD HARD technology
HEXFETs demonstrate excellent threshold voltage
stability and breakdown voltage stability at total
radiaition doses as high as 1x10
identical pre- and post-irradiation test conditions, In-
ternational Rectifier’s RAD HARD HEXFETs retain
identical electrical specifications up to 1 x 10
(Si) total dose. No compensation in gate drive circuitry
is required. These devices are also capable of surviv-
ing transient ionization pulses as high as 1 x 10
(Si)/Sec, and return to normal operation within a few
microseconds. Since the RAD HARD process utilizes
International Rectifier’s patented HEXFET technology,
the user can expect the highest quality and reliability
in the industry.
RAD HARD HEXFET transistors also feature all of
the well-established advantages of MOSFETs, such
as voltage control, very fast switching, ease of paral-
leling and temperature stability of the electrical pa-
rameters. They are well-suited for applications such
as switching power supplies, motor controls, invert-
ers, choppers, audio amplifiers and high-energy
pulse circuits in space and weapons environments.
Absolute Maximum Ratings
www.irf.com
I D @ V GS = 12V, T C = 25°C
I D @ V GS = 12V, T C = 100°C Continuous Drain Current
P D @ T C = 25°C
T STG
dv/dt
V GS
E AS
I DM
T J
®
TRANSISTOR
Parameter
Pulsed Drain Current
Max. Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction
Storage Temperature Range
Lead Temperature
Weight
Continuous Drain Current
6
Rads(Si). Under
12
5
Rads
Rads
Product Summary
Features:
Part Number
Radiation Hardened up to 1 x 10
Single Event Burnout (SEB) Hardened
Single Event Gate Rupture (SEGR) Hardened
Gamma Dot (Flash X-Ray) Hardened
Neutron Tolerant
Identical Pre- and Post-Electrical Test Conditions
Repetitive Avalanche Rating
Dynamic dv/dt Rating
Simple Drive Requirements
Ease of Paralleling
Hermetically Sealed
IRHF7130
IRHF8130
300 (0.063 in. (1.6mm) from case for 10s)
IRHF7130, IRHF8130
0.98 (typical)
-55 to 150
BV
100V
100V
JANSR2N7261
JANSH2N7261
0.20
±20
8.0
5.0
130
32
25
5.5
DSS
MEGA RAD HARD
IRHF8130
IRHF7130
Pre-Irradiation
R
N CHANNEL
0.18
0.18
DS(on)
6
Rads (Si)
PD - 90653B
Units
W/°C
V/ns
8.0A
8.0A
mJ
o
W
A
V
C
g
I
D
10/14/98
1

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JANSH2N7261 Summary of contents

Page 1

... Gamma Dot (Flash X-Ray) Hardened Neutron Tolerant Identical Pre- and Post-Electrical Test Conditions Repetitive Avalanche Rating Dynamic dv/dt Rating Simple Drive Requirements Ease of Paralleling Hermetically Sealed 300 (0.063 in. (1.6mm) from case for 10s 90653B IRHF7130 IRHF8130 JANSR2N7261 JANSH2N7261 N CHANNEL MEGA RAD HARD DSS DS(on) D 100V 0.18 8.0A 100V ...

Page 2

IRHF7130, IRHF8130,JANSR-,JANSH-,2N7261 Devices Electrical Characteristics Parameter BV DSS Drain-to-Source Breakdown Voltage BV DSS / T J Temperature Coefficient of Breakdown Voltage R DS(on) Static Drain-to-Source On-State Resistance V GS(th) Gate Threshold Voltage g fs Forward Transconductance I DSS Zero Gate ...

Page 3

... International Rectifier comprises three radiation environments. Every manufacturing lot is tested in a low dose rate (total dose) environment per MIL-STD-750, test method 1019 condition A. International Rectifier has imposed a standard gate condition of 12 volts per note 5 and a V bias condition equal to 80% of the DS device rated voltage per note 6 ...

Page 4

IRHF7130, IRHF8130,JANSR-,JANSH-,2N7261 Devices Fig 1. Typical Response of Gate Threshhold Voltage Vs. Total Dose Exposure Fig 3. Typical Response of Transconductance Vs. Total Dose Exposure 4 Fig 2. Typical Response of On-State Resistance Vs. Total Dose Exposure Fig 4. Typical ...

Page 5

Post-Irradiation Fig 5. Typical Zero Gate Voltage Drain Current Vs. Total Dose Exposure Fig 7. Typical Transient Response of Rad Hard HEXFET During 12 1x10 Rad (Si)/Sec Exposure www.irf.com IRHF7130, IRHF8130,JANSR-,JANSH-,2N7261 Devices Fig 6. Typical On-State Resistance Vs. Fig 8a. ...

Page 6

IRHF7130, IRHF8130, JANSR-,JANSH-,2N7261 Devices Note: Bias Conditions during radiation: V Fig 10. Typical Output Characteristics Pre-Irradiation Fig 12. Typical Output Characteristics Post-Irradiation 300K Rads (Si Vdc Vdc GS DS Fig 11. Typical Output Characteristics ...

Page 7

Radiation Characterstics Note: Bias Conditions during radiation: V Fig 14. Typical Output Characteristics Pre-Irradiation Fig 16. Typical Output Characteristics Post-Irradiation 300K Rads (Si) www.irf.com JANSR-,JANSH-,2N7261 Devices = 0 Vdc Vdc GS DS Fig 15. Typical Output Characteristics ...

Page 8

IRHF7130, IRHF8130,JANSR-,JANSH-,2N7261 Devices Fig 18. Typical Output Characteristics Fig 20. Typical Transfer Characteristics 8 Pre-Irradiation Fig 19. Typical Output Characteristics Fig 21. Normalized On-Resistance Vs. Temperature www.irf.com ...

Page 9

Pre-Irradiation Fig 22. Typical Capacitance Vs. Drain-to-Source Voltage Fig 24. Typical Source-Drain Diode Forward Voltage www.irf.com IRHF7130, IRHF8130,JANSR-,JANSH-,2N7261 Devices Fig 23. Typical Gate Charge Vs. Fig 25. Maximum Safe Operating 30 Gate-to-Source Voltage Area 9 ...

Page 10

IRHF7130, IRHF8130,JANSR-,JANSH-,2N7261 Devices Fig 26. Maximum Drain Current Vs. Case Temperature Fig 28. Maximum Effective Transient Thermal Impedance, Junction-to-Case 10 Pre-Irradiation D.U. 12V Pulse Width µs Duty Factor Fig 27a. Switching Time Test Circuit ...

Page 11

Pre-Irradiation 12V 20V Fig 29a. Unclamped Inductive Test Circuit Fig 29b. Unclamped Inductive Waveforms ...

Page 12

IRHF7130, IRHF8130,JANSR-,JANSH-,2N7261 Devices See Figures 18 through 30 for pre-radiation curves Repetitive Rating; Pulse width limited by maximum junction temperature. Refer to current HEXFET reliability report 25V, Starting 25°C, Peak 8.0A,L>3.0mH ...

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