BZT52C24 Diodes Incorporated, BZT52C24 Datasheet
BZT52C24
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BZT52C24 Summary of contents
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Features Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes Mechanical Data Case: SOD-123, Plastic UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020A Terminals: Solderable per MIL-STD-202, ...
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... WH 12 BZT52C13 WI 13 BZT52C15 WJ 15 BZT52C16 WK 16 BZT52C18 WL 18 BZT52C20 WM 20 BZT52C22 WN 22 BZT52C24 WO 24 BZT52C27 WP 27 BZT52C30 WQ 30 BZT52C33 WR 33 BZT52C36 WS 36 BZT52C39 WT 39 Notes: 1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm 2. Short duration test pulse used to minimize self-heating effect. ...
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T , AMBIENT TEMPERATURE ( C) A Fig. 1 Power Dissipation vs Ambient Temperature 25°C C10 j C12 C15 20 C18 C22 10 Test current I ...