BZT52C24 Diodes Incorporated, BZT52C24 Datasheet
BZT52C24
Manufacturer Part Number
BZT52C24
Description
SURFACE MOUNT ZENER DIODE
Manufacturer
Diodes Incorporated
Datasheet
1.BZT52C24.pdf
(3 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
BZT52C24-7-F 24V
Manufacturer:
DIODES
Quantity:
3 000
Part Number:
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Manufacturer:
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Company:
Part Number:
BZT52C24S
Manufacturer:
DIODES
Quantity:
30 000
Part Number:
BZT52C24S
Manufacturer:
JINGDAO/晶导微
Quantity:
20 000
Part Number:
BZT52C24S-TP
Manufacturer:
MCC/美微科
Quantity:
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Part Number:
BZT52C24WO
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20 000
Date Code Key
Notes:
Marking Information
Features
Mechanical Data
Maximum Ratings
DS18004 Rev. 19 - 2
Forward Voltage (Note 2)
Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Planar Die Construction
500mW Power Dissipation on Ceramic PCB
General Purpose, Medium Current
Ideally Suited for Automated Assembly
Processes
Case: SOD-123, Plastic
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020A
Terminals: Solderable per MIL-STD-202,
Method 208
Polarity: Cathode Band
Marking: See Below
Weight: 0.01 grams (approx.)
Ordering Information: See Page 4
Month
1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm
2. Short duration test pulse used to minimize self-heating effect.
Code
Code
Year
Characteristic
Jan
1
1998
J
@ T
A
Feb
= 25 C unless otherwise specified
2
1999
K
March
@ I
XX
3
F
= 10mA
Apr
2000
4
L
BZT52C2V4 - BZT52C39
May
1 of 3
5
XX = Product Type Marking Code (See Page 2)
YM = Date Code Marking
Y = Year (ex: N = 2002)
M = Month (ex: 9 = September)
Symbol
T
H
C
j,
R
2001
V
P
T
M
F
d
JA
STG
Jun
6
A
B
Jul
7
2002
SURFACE MOUNT ZENER DIODE
N
Aug
G
-65 to +150
2
8
.
E
Value
D
500
305
0.9
2003
P
Sep
9
J
BZT52C2V4 - BZT52C39
Oct
O
Dim
2004
All Dimensions in mm
C
D
G
H
A
B
E
J
R
SOD-123
Nov
3.55
2.55
1.40
0.25
Min
Unit
mW
0.55 Typical
0.11 Typical
C/W
N
—
—
0
V
C
2005
S
Max
3.85
2.85
1.70
1.35
0.10
Dec
—
8
D
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BZT52C24 Summary of contents
Page 1
Features Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes Mechanical Data Case: SOD-123, Plastic UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020A Terminals: Solderable per MIL-STD-202, ...
Page 2
... WH 12 BZT52C13 WI 13 BZT52C15 WJ 15 BZT52C16 WK 16 BZT52C18 WL 18 BZT52C20 WM 20 BZT52C22 WN 22 BZT52C24 WO 24 BZT52C27 WP 27 BZT52C30 WQ 30 BZT52C33 WR 33 BZT52C36 WS 36 BZT52C39 WT 39 Notes: 1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm 2. Short duration test pulse used to minimize self-heating effect. ...
Page 3
T , AMBIENT TEMPERATURE ( C) A Fig. 1 Power Dissipation vs Ambient Temperature 25°C C10 j C12 C15 20 C18 C22 10 Test current I ...