MAS1175 Micro Analog systems, MAS1175 Datasheet - Page 6

• Manufacturer Part Number: MAS1175
• Description: IC FOR 10.00 - 20.00 MHz VCTCXO
• Manufacturer: Micro Analog systems

SOLDERING INFORMATION
N For Sn/Pb MSOP-10
N For Pb Free, RoHS Compliant MSOP-10
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
Seating Plane Co-planarity
Lead Finish
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
Lead Finish
Thermal profile parameters stated in JESD22-A113 should not
Thermal profile parameters stated in IPC/JEDEC J-STD-020
Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15%
According to RSH test IEC 68-2-58/20 2*220°C
Solder plate 7.62 - 25.4 µm, material Matte Tin
should not be exceeded.
According to RSH test IEC 68-2-58/20
be exceeded.
max 0.08 mm
240°C
http://www.jedec.org
260°C
3
3
http://www.jedec.org
13 July, 2006
DA1175.008
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