AN1908 Freescale Semiconductor / Motorola, AN1908 Datasheet - Page 4

• Manufacturer Part Number: AN1908
• Description: Solder Mounting Method for the MRF19090S and Similar Packages
• Manufacturer: Freescale Semiconductor / Motorola

AN1908
4
Freescale Semiconductor, Inc.
For More Information On This Product,
PLACE DEVICE FLANGE IN THE SLOT
WITH LEADS OVER SOLDER PASTE
SOLDER REFLOW IN CONVECTION
Figure 8. Process Flow for Board Assembly
THERMAL COMPOUND TO BACK
SCREEN PRINT SOLDER PASTE
REMOVE REUSABLE REFLOW
MOUNT COPPER PLATE TO
PLACE SOLDER PREFORMS
ALUMINUM HEATSINK WITH
ATTACH REFLOW FIXTURE.
IN SLOT WITH FLUX OVER
FIXTURE. EVENLY APPLY
PLATE USING SCREWS.
REFLOW FURNACE.
OF COPPER PLATE.
ATTACH PCB TO Cu
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ON THE PCB.
ON THE PCB.
PREFORMS.
SCREWS.
MOTOROLA SEMICONDUCTOR APPLICATION INFORMATION
BTU REFLOW FURNACE.
PREHEAT 150 C FOR
1 MINUTE. SPIKE TO
215 C 10 C.
0.0005–0.001 INCH
THERMAL COMPOUND
EVENLY APPLIED TO
BACK OF COPPER PLATE.
6 MIL THICK
STAINLESS STENCIL.
NO CLEAN FLUX.
FOUR #4–40 SOCKET
HEAD CAP SCREWS.
Sn/Pb/Ag 62/36/2.
NO CLEAN FLUX
(IPC SPECS) – 2 DROPS.