MTD3N25E Motorola, MTD3N25E Datasheet
MTD3N25E
Related parts for MTD3N25E
MTD3N25E Summary of contents
Page 1
... Preferred devices are Motorola recommended choices for future use and best overall value. REV 2 Motorola TMOS Power MOSFET Transistor Device Data Motorola, Inc. 1995 D G Rating 10 ms) ) Order this document by MTD3N25E/D MTD3N25E Motorola Preferred Device TMOS POWER FET 3 AMPERES 250 VOLTS R DS(on) = 1.4 OHM CASE 369A–13, Style 2 DPAK S ...
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... MTD3N25E ELECTRICAL CHARACTERISTICS ( unless otherwise noted) Characteristic OFF CHARACTERISTICS Drain–Source Breakdown Voltage ( Vdc 250 Adc) Temperature Coefficient (Positive) Zero Gate Voltage Drain Current ( 250 Vdc Vdc 250 Vdc Vdc 125 C) Gate–Body Leakage Current ( ...
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... 1.6 1.5 1.4 1.3 1.2 1.1 1.0 4.5 5.0 5.5 6.0 0 0.5 1.0 Figure 4. On–Resistance versus Drain Current 100 1.0 100 125 150 DRAIN–TO–SOURCE VOLTAGE (VOLTS) Figure 6. Drain–To–Source Leakage MTD3N25E – 100 C 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6 DRAIN CURRENT (AMPS) and Gate Voltage ...
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... MTD3N25E Switching behavior is most easily modeled and predicted by recognizing that the power MOSFET is charge controlled. The lengths of various switching intervals ( t) are deter- mined by how fast the FET input capacitance can be charged by current from the generator. The published capacitance data is difficult to use for calculat- ing rise and fall because drain– ...
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... DM ), the energy rating is specified at rated continuous cur- rent ( accordance with industry custom. The energy rat- ing must be derated for temperature as shown in the accompanying graph (Figure 12). Maximum energy at cur- rents below rated continuous I D can safely be assumed to equal the values indicated. MTD3N25E t d(off d(on ...
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... MTD3N25E SINGLE PULSE 100 s 1 0.1 R DS(on) LIMIT THERMAL LIMIT PACKAGE LIMIT 0.01 0.1 1 DRAIN–TO–SOURCE VOLTAGE (VOLTS) Figure 11. Maximum Rated Forward Biased Safe Operating Area 1 0.5 0.2 0.1 0.1 0.05 0.02 0.01 SINGLE PULSE 0.01 1.0E–05 1.0E–04 6 SAFE OPERATING AREA ...
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... Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad . Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. MTD3N25E Board Material = 0.0625 G–10/FR– Copper 5.0 Watts ...
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... MTD3N25E Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. Solder stencils are used to screen the optimum amount. These stencils are typically 0.008 inches thick and may be made of brass or stainless steel. For packages such as the SC–59, SC– ...
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... C 160 C 150 C SOLDER IS LIQUID FOR SECONDS 100 C 140 C (DEPENDING ON MASS OF ASSEMBLY) DESIRED CURVE FOR LOW MASS ASSEMBLIES Figure 17. Typical Solder Heating Profile MTD3N25E STEP 6 STEP 7 VENT COOLING 205 TO 219 C PEAK AT SOLDER JOINT T MAX 9 ...
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... D 0.027 0.035 0.69 0.88 E 0.033 0.040 0.84 1.01 F 0.037 0.047 0.94 1.19 G 0.180 BSC 4.58 BSC H 0.034 0.040 0.87 1.01 J 0.018 0.023 0.46 0.58 K 0.102 0.114 2.60 2.89 L 0.090 BSC 2.29 BSC R 0.175 0.215 4.45 5.46 S 0.020 0.050 0.51 1.27 U 0.020 ––– 0.51 ––– V 0.030 0.050 0.77 1.27 Z 0.138 ––– 3.51 ––– MTD3N25E/D ...