MTD9N10E Motorola, MTD9N10E Datasheet
MTD9N10E
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MTD9N10E Summary of contents
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... Preferred devices are Motorola recommended choices for future use and best overall value. REV 2 Motorola TMOS Power MOSFET Transistor Device Data Motorola, Inc. 1995 G Rating 10 ms Order this document by MTD9N10E/D MTD9N10E Motorola Preferred Device TMOS POWER FET 9.0 AMPERES 100 VOLTS R DS(on) = 0.25 OHM D CASE 369A–13, Style 2 ...
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... MTD9N10E www.DataSheet4U.com ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Drain–Source Breakdown Voltage ( Vdc 250 Adc) Temperature Coefficient (Positive) Zero Gate Voltage Drain Current ( 100 Vdc Vdc 100 Vdc Vdc 125 C) Gate–Body Leakage Current ( ...
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... C 0.17 – 0. 100 10 1.0 0 100 125 150 30 MTD9N10E – 100 C 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7 GATE–TO–SOURCE VOLTAGE (VOLTS) Figure 2. Transfer Characteristics DRAIN CURRENT (AMPS) Figure 4. On–Resistance versus Drain Current ...
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... MTD9N10E www.DataSheet4U.com Switching behavior is most easily modeled and predicted by recognizing that the power MOSFET is charge controlled. The lengths of various switching intervals ( t) are deter- mined by how fast the FET input capacitance can be charged by current from the generator. The published capacitance data is difficult to use for calcu- lating rise and fall because drain– ...
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... accordance with industry custom. The energy rat- ing must be derated for temperature as shown in the accompanying graph (Figure 12). Maximum energy at cur- rents below rated continuous I D can safely be assumed to equal the values indicated. MTD9N10E ...
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... MTD9N10E www.DataSheet4U.com 100 SINGLE PULSE 100 s 1.0 0.1 R DS(on) LIMIT THERMAL LIMIT PACKAGE LIMIT 0.01 0.1 1 DRAIN–TO–SOURCE VOLTAGE (VOLTS) Figure 11. Maximum Rated Forward Biased Safe Operating Area 1 0.5 0.2 0.1 0.1 0.05 0.02 0.01 SINGLE PULSE 0.01 1.0E–05 1.0E–04 6 SAFE OPERATING AREA ...
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... Figure 15. Thermal Resistance versus Drain Pad Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad . Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. MTD9N10E 0.063 1.6 0.243 6.172 inches mm Board Material = 0 ...
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... MTD9N10E www.DataSheet4U.com Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. Solder stencils are used to screen the optimum amount. These stencils are typically 0.008 inches thick and may be made of brass or stainless steel. For packages such as the SC–59, SC– ...
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... DESIRED CURVE FOR HIGH 160 C MASS ASSEMBLIES 150 C 100 C 140 C DESIRED CURVE FOR LOW MASS ASSEMBLIES TIME ( MINUTES TOTAL) Figure 17. Typical Solder Heating Profile MTD9N10E STEP 5 STEP 6 STEP 7 HEATING VENT COOLING ZONES 4 & 7 “SPIKE” 205 TO 219 C PEAK AT ...
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... D 0.027 0.035 0.69 0.88 E 0.033 0.040 0.84 1.01 F 0.037 0.047 0.94 1.19 G 0.180 BSC 4.58 BSC H 0.034 0.040 0.87 1.01 J 0.018 0.023 0.46 0.58 K 0.102 0.114 2.60 2.89 L 0.090 BSC 2.29 BSC R 0.175 0.215 4.45 5.46 S 0.020 0.050 0.51 1.27 U 0.020 ––– 0.51 ––– V 0.030 0.050 0.77 1.27 Z 0.138 ––– 3.51 ––– MTD9N10E/D *MTD9N10E/D* ...