SPI-240-15-T1 Sanyo Semicon Device, SPI-240-15-T1 Datasheet - Page 5

• Manufacturer Part Number: SPI-240-15-T1
• Description: Ultraminiature photointerrupter supporting reflow soldering (Darlington-transistor type)
• Manufacturer: Sanyo Semicon Device

Package dimensions and Pin connection
As stated in the sttached paper. (No.6027 4/7)
Soldering conditions
(1) Reflow soldering
(2) Manusl soldering
(1) Bending a lead should avoid. However, when bending is necessary, take care the next items.
(2) The hole pitch of a circuit board must fit to the recommended mounting dimension.
(3) Take core the following when soldering.
(4) Use the flux which contain no chlorine, have no corrosion and do not need washing.
(5) Be careful that flux or other chemicals do not attach to the luminous surface and passive surface.
(6) Precautions of the product after the open dry packing
(7) The reflow conditions must be confirmed that no problem by your reflow furnace.
The temperature of the reflow furnace is to be set in accordance with the following temperature profile.
Soldering must be done only one time.
q Bending a lead must be done before soldering.
w Bending a lead must be done in the states of fixing leads and no stress for the regin part. Because it is possible that
e A lead must be bend under the stay.
r Do not bend the same position of leads more than twice.
q Do not heat a product under any stress (a twist and so on) to leads.
w Do not heat a product in the states of operating force to the regin part.
q The product after the open dry packing should be stored in the dry packing again.
w The product to be out the term without dry packing must be practiced baking.
PRECAUTIONS
stress for the regin part cause troubles such as gold wire breaking and so on.
The product should be kept under the conditions below, if the product is not stored in the dry paking.
Temperature
Humidity
Term
Baking conditions
Temperature
Reflow type
Temperature
Time
Clearance
: On the topsurface of product
: Hot air
: Max. 290 C (Soldering iron tip temperature)
: Max. 3 sec
: Min. 0.5mm from package
: 5 to 30 C
: Max 70%RH
: Max 7days
Max 220 C
Max 160 C
: +60 5 C, 10 to 20Hr
180 C
SPI-240-15-T1
Max 60sec
0.5mm
Max 5sec
Max 40sec
0.5mm
No.6027 5/7