SPC5561MZQ132 Freescale Semiconductor / Motorola, SPC5561MZQ132 Datasheet
SPC5561MZQ132
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SPC5561MZQ132 Summary of contents
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Freescale Semiconductor Data Sheet: Technical Data MPC5561 Microcontroller Data Sheet by: Microcontroller Division This document provides electrical specifications, pin assignments, and package diagrams for the MPC5561 microcontroller device. For functional characteristics, refer to the MPC5561 Microcontroller Reference Manual. 1 Overview ...
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Overview The MPC5500 family of parts contains many new features coupled with high performance CMOS technology to provide significant performance improvement over the MPC565. The host processor core of the MPC5561 also includes an instruction set enhancement allowing variable length ...
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Ordering Information Qualification status Temperature range Package identifier Operating frequency (MHz) Tape and reel status Package Identifier Temperature Range ZQ = 324PBGA SnPb M = –40° 125° 324PBGA Pb-free Note: Not all options are ...
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Electrical Characteristics 3 Electrical Characteristics This section contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MCU. 3.1 Maximum Rating Spec Characteristic 2 1 1.5 V core supply voltage 2 Flash program/erase voltage 4 ...
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Table 2. Absolute Maximum Ratings Spec Characteristic 11 28 Maximum solder temperature Lead free (Pb-free) Leaded (SnPb Moisture sensitivity level 1 Functional operating conditions are given in the DC electrical specifications. Absolute maximum ratings are stress ratings only, ...
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Electrical Characteristics 3.2.1 General Notes for Specifications at Maximum Junction Temperature An estimation of the device junction temperature, T × θ where ambient temperature for the package ( A R ...
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At a known board temperature, the junction temperature is estimated using the following equation: × θ where junction temperature ( board temperature at the package perimeter ( ...
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Electrical Characteristics so that the thermocouple junction rests on the package. Place a small amount of epoxy on the thermocouple junction and approximately wire extending from the junction. Place the thermocouple wire flat against the package case ...
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ESD (Electromagnetic Static Discharge) Characteristics Characteristic ESD for human body model (HBM) HBM circuit description ESD for field induced charge model (FDCM) Number of pulses per pin: Positive pulses (HBM) Negative pulses (HBM) Interval of pulses 1 All ESD ...
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Electrical Characteristics Table 6. VRC/POR Electrical Specifications (continued) Spec Characteristic 9 Absolute value of slew rate on power supply pins Required gain at Tj: ÷ VRCCTL sys MAX ...
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When powering down, V and V RC33 capacitors internal and external to the device are already charged. When not powering up or down, no delta between V and V is required for the V RC33 DDSYN There are no power ...
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Electrical Characteristics therefore cannot read the default state when POR negates. V pin (V ), but cannot lag both by more than the V DDEH6 applies during power up only. V DD33 3.7.2 Power-Up Sequence (V The 1 ...
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DC Electrical Specifications Table 9. DC Electrical Specifications (T Spec Characteristic 1 Core supply voltage (average DC RMS voltage) 2 Input/output supply voltage (fast input/output) 3 Input/output supply voltage (slow and medium input/output) 4 3.3 V input/output buffer voltage ...
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Electrical Characteristics Table 9. DC Electrical Specifications (T Spec Characteristic 27a Operating current 1.5 V supplies @ 135 MHz: 7 8-way cache V (including V max current) @1.65 V typical use DD DDF V (including V max current) @1.35 V ...
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Table 9. DC Electrical Specifications (T Spec Characteristic 29 Operating current 5.0 V supplies (12 MHz ADCLK DDA DDA0 DDA1 Analog reference supply current ( Operating current V supplies: DDE V ...
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Electrical Characteristics Table 9. DC Electrical Specifications (T Spec Characteristic 45 Operating temperature range, ambient (packaged) 46 Slew rate on power-supply pins 1 V and V are limited to 2.25–3.6 V only if EBTS = 0; V DDE2 DDE3 2 ...
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Figure 3 shows an approximate interpolation of the I different voltages and temperatures. The vertical lines shown at 25 the I specifications (27d) listed in DD_STBY 2000 1900 1800 1700 1600 1500 1400 1300 1200 1100 1000 900 800 700 ...
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Electrical Characteristics Table 10. I/O Pad Average DC Current (T Spec Pad Type Symbol 5 6 Medium I DRV_MH Fast I DRV_FC ...
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Table 11. V Frequency Spec Pad Type Symbol 1 Slow I 33_SH 2 Medium I 33_MH Fast I 33_FC ...
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Electrical Characteristics 3.9 Oscillator and FMPLL Electrical Characteristics Table 12. FMPLL Electrical Specifications (V DDSYN Spec Characteristic PLL reference frequency range: 2 Crystal reference (20) 3 Crystal reference (40 External reference (20) 3 External reference (40) Dual controller ...
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Table 12. FMPLL Electrical Specifications (continued) (V DDSYN Spec Characteristic CLKOUT period jitter, measured Peak-to-peak jitter (clock edge to clock edge) Long term jitter (averaged over interval) Frequency modulation range limit 20 (do not ...
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Electrical Characteristics 3.10 eQADC Electrical Characteristics Table 13. eQADC Conversion Specifications ( Spec Characteristic 1 1 ADC clock (ADCLK) frequency Conversion cycles 2 Differential Single ended 2 3 Stop mode recovery time 3 4 Resolution 5 INL: 6 MHz ADC ...
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H7Fa Flash Memory Electrical Characteristics Spec Table 14. Flash Program and Erase Specifications (T Spec Flash Program Characteristic 3 Doubleword (64 bits) program time 4 4 Page program time block pre-program and erase time 9 48 ...
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Electrical Characteristics Table 16 shows the FLASH_BIU settings versus frequency of operation. Refer to the device reference manual for definitions of these bit fields. Table 16. FLASH_BIU Settings vs. Frequency of Operation Maximum Frequency (MHz and including ...
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Table 17. Pad AC Specifications (V Spec Pad 3 Fast 4 Pullup/down (3.6 V max) 5 Pullup/down (5.5 V max) 1 These are worst-case values that are estimated from simulation (not tested). The values in the table are simulated at: ...
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Electrical Characteristics 3 The output delay, and the rise and fall, are calculated to 20% or 80% of the respective signal. 4 The output delay is shown in Figure 4. To calculate the output delay with respect to the system ...
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RESET RSTOUT 3 PLLCFG BOOTCFG RSTCFG WKPCFG Figure 5. Reset and Configuration Pin Timing MPC5561 Microcontroller Data Sheet, Rev. 2.0 Freescale Semiconductor 1 Electrical Characteristics ...
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Electrical Characteristics 3.13.2 IEEE 1149.1 Interface Timing Table 20. JTAG Pin AC Electrical Characteristics Spec Characteristic 1 TCK cycle time 2 TCK clock pulse width (measured TCK rise and fall times (40% to 70%) 4 TMS, TDI ...
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TCK 4 TMS, TDI 7 TDO Figure 7. JTAG Test Access Port Timing TCK JCOMP MPC5561 Microcontroller Data Sheet, Rev. 2.0 Freescale Semiconductor Figure 8. JTAG JCOMP Timing Electrical Characteristics ...
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Electrical Characteristics TCK 11 Output signals 12 Output signals Input signals MPC5561 Microcontroller Data Sheet, Rev. 2 Figure 9. JTAG Boundary Scan Timing 15 Freescale Semiconductor ...
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Nexus Timing Spec Characteristic 1 MCKO cycle time 2 MCKO duty cycle 3 3 MCKO low to MDO data valid 3 4 MCKO low to MSEO data valid 3 5 MCKO low to EVTO data valid 6 EVTI pulse ...
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Electrical Characteristics TCK 10 TMS, TDI TDO Figure 11. Nexus TDI, TMS, TDO Timing MPC5561 Microcontroller Data Sheet, Rev. 2 Freescale Semiconductor ...
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External Bus Interface (EBI) Timing lists the timing information for the external bus interface (EBI). Characteristic Spec and Symbol Description 1 CLKOUT period 2 CLKOUT duty cycle 3 CLKOUT rise time 4 CLKOUT fall time CLKOUT positive edge to ...
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Electrical Characteristics Table 22. Bus Operation Timing Characteristic Spec and Description Input signal valid to CLKOUT positive edge (setup time) External bus interface ADDR[8:31 DATA[0:31] RD_WR TA 6 TEA TS CLKOUT positive edge to input signal invalid (hold ...
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CLKOUT 5 Output ÷ DDE bus 5 Output ÷ DDE signal Output signal Figure 13. Synchronous Output Timing MPC5561 Microcontroller Data Sheet, Rev. 2.0 Freescale Semiconductor ÷ DDE Electrical ...
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Electrical Characteristics CLKOUT Input bus Input ÷ 2 signal V DDE 3.13.5 External Interrupt Timing (IRQ Signals) Spec Characteristic 1 IRQ pulse-width low 2 IRQ pulse-width high 2 3 IRQ edge-to-edge time 1 IRQ timing specified at 3.0–5.25 ...
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IRQ 1 3.13.6 eMIOS Timing Spec Characteristic 1 eMIOS input pulse width 2 eMIOS output pulse width 1 eMIOS timing specified at 3.0–5.25 V and T DDEH 2 This specification does not include the rise and fall times. ...
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Electrical Characteristics 3.13.7 DSPI Timing Spec Characteristic SCK cycle time 5 2 PCS to SCK delay 6 3 After SCK delay SCK duty cycle 4 Slave access time 5 (SS active to SOUT driven) Slave SOUT disable ...
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PCSx SCK output (CPOL=0) SCK output (CPOL=1) SIN SOUT Figure 17. DSPI Classic SPI Timing—Master, CPHA = 0 PCSx SCK output (CPOL=0) SCK output (CPOL=1) SIN SOUT Figure 18. DSPI Classic SPI Timing—Master, CPHA = 1 MPC5561 Microcontroller Data Sheet, ...
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Electrical Characteristics SS SCK input (CPOL=0) SCK input (CPOL=1) SOUT SIN Figure 19. DSPI Classic SPI Timing—Slave, CPHA = 0 SS SCK input (CPOL=0) SCK input (CPOL=1) SOUT SIN Figure 20. DSPI Classic SPI Timing—Slave, CPHA = 1 MPC5561 Microcontroller ...
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PCSx SCK output (CPOL=0) SCK output (CPOL=1) SIN SOUT Figure 21. DSPI Modified Transfer Format Timing—Master, CPHA = 0 PCSx SCK output (CPOL=0) SCK output (CPOL=1) SIN SOUT Figure 22. DSPI Modified Transfer Format Timing—Master, CPHA = 1 MPC5561 Microcontroller ...
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Electrical Characteristics SS SCK input (CPOL=0) SCK input (CPOL=1) 5 SOUT SIN Figure 23. DSPI Modified Transfer Format Timing—Slave, CPHA = 0 SS SCK input (CPOL=0) SCK input (CPOL=1) 5 SOUT SIN Figure 24. DSPI Modified Transfer Format Timing—Slave, CPHA ...
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SSI Timing Table 26. EQADC SSI Timing Characteristics Spec Rating ÷ FCK period ( FCK FCK 3 Clock (FCK) high time 4 Clock (FCK) low time 5 SDS lead / lag ...
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Mechanicals 4 Mechanicals 4.1 MPC5561 324 PBGA Pinouts Figure pinout for the MPC5561 324 PBGA package VSSA1 A VSS VDD VSTBY AN37 AN11 VDDA1 AN16 B VDD33 VSS VDD AN36 ...
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MPC5561 324-Pin Package Dimensions The package drawings of the MPC5561 324-pin TEPBGA package are shown in Figure 28. MPC5561 324 TEPBGA Package MPC5561 Microcontroller Data Sheet, Rev. 2.0 Freescale Semiconductor Mechanicals Figure 28. 45 ...
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Mechanicals Figure 28. MPC5561 324 TEPBGA Package (continued) MPC5561 Microcontroller Data Sheet, Rev. 2.0 46 Freescale Semiconductor ...
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Revision History for the MPC5561 Data Sheet The history of revisions made to this data sheet are shown in this section. The changes are divided into each revision of this document. The substantive changes incorporated in MPC5561 Data Sheet ...
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Revision History for the MPC5561 Data Sheet Table 27. Global and Text Changes Between Rev. 0.0 and Rev. 1.0 (continued) Location Section 3.7.1, “Input Value of Pins During POR Dependent on Added the following text directly before this section and ...
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Table 28. Table and Figure Changes Between Rev. 0.0 and 1.0 (continued) Location Table 2 Absolute Maximum Ratings: • Deleted Spec 3, “Flash core voltage.” • Spec 12 “DC Input Voltage”: Deleted from second line‘. . .except for eTPUB15 and ...
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Revision History for the MPC5561 Data Sheet Table 28. Table and Figure Changes Between Rev. 0.0 and 1.0 (continued) Location Table 7 Power Sequence Pin Status for Fast Pads • Changed title to Pin Status for Fast Pads During the ...
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Table 28. Table and Figure Changes Between Rev. 0.0 and 1.0 (continued) Location Table 9 DC Electrical Specifications: (continued) • Spec 27c, Operating current 1.5 V supplies @ 82 MHz: Added maximum values for 8-way cache: 1.65 typical = 490, ...
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Revision History for the MPC5561 Data Sheet Table 28. Table and Figure Changes Between Rev. 0.0 and 1.0 (continued) Location Table 13 eQADC Conversion Specifications: Added (T Table 14 Flash Program and Erase Specifications: • Added ( – ...
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Table 28. Table and Figure Changes Between Rev. 0.0 and 1.0 (continued) Location Table 22 Bus Operation Timing: • Changed Spec 1 for the minimum 67 MHz column from: 15.2 to 14.9. • Specs 5 and 6: corrected format to ...
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Revision History for the MPC5561 Data Sheet Table 29. Information Changed Between Rev. 1.0 and Rev. 2.0 (continued) Location Table 9 DC Electrical Specifications • Added footnote that reads range of 1.6–3 EBTS =1. • Spec ...
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Table 29. Information Changed Between Rev. 1.0 and Rev. 2.0 (continued) Location Table 24 eMIOS Timing: • Footnote 1, changed ‘V DDEH • Deleted (MTS) from the heading, table, and footnotes. • Footnote 1: Deleted ‘ SYS with ...
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