SKY65342-11 Skyworks Solutions, SKY65342-11 Datasheet - Page 11

• Manufacturer Part Number: SKY65342-11
• Description: Front-End Module
• Manufacturer: Skyworks Solutions

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Thermal Via Array
All measurements are in millimeters
NOTE: It is recommended that thermal vias
should be filled with 30-35 μm Cu plating.
Additional vias in common ground pad
will improve thermal performance.
∅
0.3 mm on 1.0 mm pitch.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
8.685
201139C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • October 26, 2009
11X 1.043
1.91 Typ
Pin 1
0.25
Pin 12
module/pkg solder mask area
Stencil aperture 60-80% of
6X 0.81
Figure 12. SKY65342-11 Phone Board Layout Footprint
Metallization
Top View
8.685
C L
1.65 Typ
2X 1.65
Stencil Aperture
Top View
C L
8.685
C L
Component
Outline
∅
Mask Opening
5.080 Solder
12X 0.81
Pin 12
Pin 1
12X 1.043
C L
DATA SHEET • SKY65342-11 FRONT-END MODULE
2X 1.91
Solder Mask Opening
Component
Outline
8.685
1.65
Top View
8.785
C L
12X 0.91
C L
1.91 Typ
12X 1.143
Component
Outline
8.785
S1357
11
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