SKY77162 Skyworks Solutions, SKY77162 Datasheet - Page 9

• Manufacturer Part Number: SKY77162
• Description: System Smart Power Amplifier Module
• Manufacturer: Skyworks Solutions

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SYSTEM SMART
Package Dimensions and Pad Descriptions
The SKY77162 is a multi-layer laminate base, overmold
encapsulated modular package designed for surface mount solder
attachment to a printed circuit board.
drawing of the pad layout for this package.
recommended phone board layout footprint for the PAM to help
the designer attain optimum thermal conductivity, good
NOTES: Unless otherwise specified
1. DIMENSIONING AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M–1994.
2. SEE APPLICABLE BONDING DIAGRAM AND DEVICE ASSEMBLY DRAWING FOR DIE AND COMPONENT PLACEMENT.
3. PADS ARE SOLDER MASK DEFINED ON ALL INSIDE EDGES.
4. ALL DIMENSIONS ARE IN MILLIMETERS.
METAL PAD EDGE
2X THIS ROTATION
2X ROTATED 180˚
1.15 ±0.1
SCALE: 2X
DETAIL
SMT PAD
200005A • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • May 2, 2006
®
(0.1)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
PAM FOR CDMA / AMPS (824–849 MHz)
A
0.4 ±0.03
0.4 ±0.03
SIDE VIEW
0.5 ±0.03
Figure 11. SKY77162 Package Dimensional Drawing (All Views)
METAL PAD EDGES
Figure 11
A
0.1
(0.1)
1X THIS ROTATION
1X ROTATED 180˚
1X ROTATED 90˚ CW
1X ROTATED 90˚ CCW
Figure 12
SCALE: 2X
DETAIL
SMT PAD
is a mechanical
B
provides a
0.4 ±0.03
4X 1.4
0.4 ±0.03
2X 1.325
SOLDER MASK OPENING
4X 1.2
PIN 1
LOCATOR
grounding, and minimum RF discontinuity for the 50 ohm
terminals.
numbering convention, which starts with pad 1 in the upper left
and increments counter-clockwise around the package.
illustrates typical case markings.
0.15 A B C
3X R0.2
8X 1.4
2X 0.7
B
A
Figure 13
BOTTOM VIEW
TOP VIEW
shows the pad names and the pad
3
0.05 A B C
0.2 X 0.2
PIN 1 ID
B
8X SMT PAD
DATA SHEET • SKY77162
3
C
0.05 M A B C
0.025 M A
4X 0.4
200005_011
Figure 14
9