BU4508DX Philips Semiconductors, BU4508DX Datasheet
BU4508DX
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BU4508DX Summary of contents
Page 1
... 16kHz 5A 16kHz Csat PIN CONFIGURATION case CONDITIONS ˚C hs CONDITIONS with heatsink compound in free air 1 Product specification BU4508DX TYP. MAX. UNIT - 1500 V - 800 3 1.85 2.2 V 300 400 ...
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... 500 mA 5 CONDITIONS 1.0 A;(I Csat / Product specification BU4508DX MIN. TYP. MAX. UNIT - - 2500 - 22 - MIN. TYP. MAX. UNIT - - 1 2.0 mA 7.5 13 800 - - - - 3.0 0.85 0.94 1 ...
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... I 100 F time time 0.01 and Product specification BU4508DX + 150 v nominal adjust for ICsat Lc D.U.T. LB Cfb Rbe Fig.4. Switching times test circuit . hFE BU4508DF/X/Z Ths = 25 C VCE = 1V Ths = 85 C 0.1 1 Fig.5. High and low DC current gain. BU4508DF/X/Z hFE Ths = 25 C ...
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... BU4508DF/X/Z 10 Ths = 25 C Ths = 85 C 0.1 0.01 0.001 1.0E- BU4508D ts/tf ICsat = 5 A Ths = 85 C Freq = 16 kHz 2 2 Product specification BU4508DX Normalised Power Derating PD% with heatsink compound 100 120 Ths / C Fig.10. Normalised power dissipation. PD% = 100 25˚C Zth K/W 0.5 1 0.2 0.1 ...
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... Net Mass: 5.88 g 4.5 27 max 22.5 max 18.1 min Fig.12. SOT399; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". February 1999 16.0 max 0.7 10.0 25.1 25.7 5.1 2.2 max 4.5 1.1 0.4 M 5.45 5.45 5 Product specification BU4508DX 5.8 max 3.0 3 0.9 max 3.3 Rev 1.000 ...
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... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. February 1999 6 Product specification BU4508DX Rev 1.000 ...