LTC3588-1 Linear Technology, LTC3588-1 Datasheet - Page 18

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LTC3588-1

Manufacturer Part Number
LTC3588-1
Description
Piezoelectric Energy Harvesting Power Supply
Manufacturer
Linear Technology
Datasheet
www.DataSheet4U.com
LTC3588-1
PACKAGE DESCRIPTION
3.50 ±0.05
18
2.15 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
0.25 ± 0.05
1.65 ±0.05
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
TOP AND BOTTOM OF PACKAGE
(2 SIDES)
2.38 ±0.05
(2 SIDES)
0.50
BSC
0.675 ±0.05
PACKAGE
OUTLINE
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
(SEE NOTE 6)
TOP MARK
DD Package
PIN 1
0.200 REF
0.75 ±0.05
3.00 ±0.10
(4 SIDES)
0.00 – 0.05
1.65 ± 0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
5
R = 0.115
6
2.38 ±0.10
(2 SIDES)
TYP
10
1
0.50 BSC
0.25 ± 0.05
0.38 ± 0.10
(DD) DFN 1103
35881f

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