MMA1200 Freescale Semiconductor, MMA1200 Datasheet - Page 7
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MMA1200
Manufacturer Part Number
MMA1200
Description
Surface Mount Micromachined Accelerometer
Manufacturer
Freescale Semiconductor
Datasheet
1.MMA1200.pdf
(10 pages)
Sensors
Freescale Semiconductor
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
Surface mount board layout is a critical portion of the total
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Figure 7. Footprint SOIC-16 (Case 475-01)
2.03 mm
0.080 in.
0.380 in.
9.65 mm
footprint, the packages will self-align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
0.050 in.
1.27 mm
0.024 in.
0.610 mm
MMA1200D
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