smp1325-085lf Skyworks Solutions, Inc., smp1325-085lf Datasheet - Page 4

• Manufacturer Part Number: smp1325-085lf
• Description: Smp1325-085lf Surface Mount Pin Diode For High Power Switch Applications
• Manufacturer: Skyworks Solutions, Inc.

DATA SHEET • SMP1325-085LF SURFACE MOUNT PIN DIODE
The effects of these parasitic series inductances are negligible,
since they add a very small insertion loss to the shunt PIN but
have no effect on the isolation that the diode produces when it is
forward biased.
A cross section of the suggested printed circuit board design is
shown in Figure 6. The via shown in this view is critical, both for
electrical performance and for thermal performance. It is
recommended that several vias should be placed under the entire
footprint of the exposed paddle (pin 2) to minimize both electrical
inductance to the system ground and thermal resistance to the
system heat sink.
Package Dimensions
The PCB layout footprint for the SMP1325-085LF is shown in
Figure 7. Typical case markings are shown in Figure 8. Package
dimensions for the 3-pin QFN are provided in Figure 9, and
Figure 10 provides the tape and reel dimensions.
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Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
August 24, 2011 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 201648A
Figure 5. SMP1325-085LF Electrically Equivalent Circuit
Figure 4. Cross-Sectional View of the SMP1325-085LF
Package and Handling Information
Instructions on the shipping container label regarding exposure to
moisture after the container seal is broken must be followed.
Otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SMP1325-085LF is rated to Moisture Sensitivity Level 1
(MSL1) at 260 °C. It can be used for lead or lead-free soldering.
For additional information, refer to the Skyworks Application Note,
Solder Reflow Information, document number 200164.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.