irf6722mpbf International Rectifier Corp., irf6722mpbf Datasheet - Page 3

• Manufacturer Part Number: irf6722mpbf
• Description: Directfet Power Mosfet
• Manufacturer: International Rectifier Corp.

ˆ
‰
Notes:
P
P
P
T
T
T
R
R
R
R
R
Absolute Maximum Ratings
Thermal Resistance
ƒ Surface mounted on 1 in. square Cu
www.irf.com
P
J
STG
D
D
D
TJA
TJA
TJA
TJC
TJ-PCB
back and with small clip heatsink.
Used double sided cooling , mounting pad with large heatsink.
Mounted on minimum footprint full size board with metalized
(still air).
@T
@T
@T
A
A
C
= 25°C
= 70°C
= 25°C
0.001
0.01
100
0.1
10
1
1E-006
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
D = 0.50
0.20
0.10
0.05
0.02
0.01
Power Dissipation
Power Dissipation
Power Dissipation
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
Linear Derating Factor
1E-005
SINGLE PULSE
( THERMAL RESPONSE )
0.0001
fl
f
jl
kl
l
Parameter
Parameter
Ã
0.001
t 1 , Rectangular Pulse Duration (sec)
‰ Mounted to a PCB with
small clip heatsink (still air)
0.01
Š
R
W
T
J
W
is measured at
J
W
1
Ci= WiRi
W
1
Ci= WiRi
0.1
R
1
R
1
W
2
R
W
2
2
R
2
T
1
J
Typ.
12.5
–––
–––
of approximately 90°C.
1.0
20
R
W
3
3
R
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
W
3
3
W
-40 to + 150
A
W
A
Ri (°C/W) Wi (sec)
Max.
0.018
footprint full size board with
metalized back and with small
clip heatsink (still air)
10
270
‰ Mounted on minimum
2.3
1.5
42
6.3466
26.688
21.955
Max.
ƒ
–––
–––
–––
3.0
55
0.00237
0.9124
43.9
100
1000
Units
Units
°C/W
W/°C
°C
W
3