tc1201 Transcom, Inc., tc1201 Datasheet - Page 6

• Manufacturer Part Number: tc1201
• Description: Low Noise And Medium Power Gaas Fets
• Manufacturer: Transcom, Inc.

LARGE SIGNAL MODEL, V
SCHEMATIC
CHIP HANDLING
DIE ATTACHMENT: Conductive epoxy or eutectic die attach is recommended. Eutectic die attach can be
accomplished with Au-Sn (80%Au-20%Sn) perform at stage temperature: 290 C
Time: less than 1min.
WIRE BONDING: The recommended wire bond method is thermocompression bonding with 0.7 to 1.0 mil
(0.018 to 0.025 mm) gold wire. Stage temperature: 220 C to 250 C; Bond Tip Temperature: 150 C; Bond Force:
20 to 30 gms depending on size of wire and Bond Tip Temperature.
HANDLING PRECAUTIONS: The user must operate in a clean, dry environment. Care should be exercised
during handling avoid damage to the devices. Electrostatic Discharge (ESD) precautions should be observed at all
stages of storage, handling, assembly, and testing. The static discharge must be less than 300V.
TRANSCOM, INC.,
Web-Site:
Lg
www.transcominc.com.tw
Cgs
Rg
Ris
Cgd
90 Dasoong 7
Rid
Id
Rs
Ls
Cds
th
Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C.
DS
= 6 V, I
Cbs
Rdb
Rd
Phone: [phone]
DS
= 40 mA
Ld
6 / 6
TOM2 MODEL PARAMETERS
Parameters
VTO
ALPHA
BETA
GAMMA
DELTA
Q
NG
ND
TAU
RG
RD
RS
IS
N
VBI
VDELTA
Fax: [phone]
0.0509
0.3815
-0.757 V
1E-11 mA LD
0.161
0.987
5.098 ps
2.205 Ohm TNOM
0.898 Ohm LS
1.631 Ohm LG
3.92
0.01
0.1
0.2
1
1
5 C; Handling Tool: Tweezers;
V
V
Parameters
VMAX
CGD
CGS
CDS
RIS
RID
VBR
RDB
CBS
AFAC
NFING
REV5_20070502
TC1201
1.7929 pF
0.0266 pF
0.0005 nH
0.0278 nH
0.0243 nH
0.032 pF
0.097 pF
7.121 Ohm
0.001 Ohm
173.9 Ohm
0.5
25
9
1
1
V
V
C