BT134W-500E NXP Semiconductors, BT134W-500E Datasheet
BT134W-500E
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BT134W-500E Summary of contents
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... / T2+ G+ T2+ G- T2- G- T2- G+ over any 20 ms period 1 Product specification BT134W series E MAX. MAX. UNIT BT134W- 500E 600E 500 600 SYMBOL MIN. MAX. UNIT -500 -600 1 ...
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... 125 ˚C D DRM(max) j CONDITIONS 125 ˚C; DM DRM(max) j exponential waveform; gate open circuit DRM(max / Product specification BT134W series E MIN. TYP. MAX. UNIT - - 15 K/W - 156 - K K/W MIN. TYP. MAX. UNIT - ...
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... I p 20ms. VGT(25 C) 1.6 I TSM 1.4 T time 1.2 1 0.8 0.6 0.4 1000 - Product specification BT134W series E BT134W 108 100 Tsp / C versus solder point temperature T BT134W 0.1 1 surge duration / s , versus surge duration, for sinusoidal T(RMS) currents Hz; T 108˚C. sp VGT(Tj) BT136 0 50 100 Fig ...
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... dVD/dt (V/us) 1000 100 10 1 100 150 (25˚C), Fig.12. Typical, critical rate of rise of off-state voltage Product specification BT134W series E BT134W typ max 0 BT134W unidirectional bidirectional 0.1ms 1ms 10ms 0. versus th j-sp pulse width t . ...
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... PRINTED CIRCUIT BOARD Fig.14. PCB for thermal resistance and power rating for SOT223. PCB: FR4 epoxy glass (1.6 mm thick), copper laminate (35 m thick). August 1997 3.8 min 1.5 min 2.3 1.5 min (3x) 1.5 min 4 4 Product specification BT134W series E Dimensions in mm. 6.3 Dimensions in mm. 18 4.5 Rev 1.200 ...
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... For further information, refer to Philips publication SC18 " SMD Footprint Design and Soldering Guidelines". Order code: 9397 750 00505. 2. Epoxy meets UL94 V0 at 1/8". August 1997 6.7 6.3 3.1 0.32 0.24 2.9 0.10 0. max 1.05 2.3 1.8 max 0.85 4.6 Fig.15. SOT223 surface mounting package. 6 Product specification BT134W series 3.7 7.3 6.7 3 0.80 M 0.1 B 0.60 (4x) Rev 1.200 M A ...
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... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. August 1997 BT134W series E 7 Product specification Rev 1.200 ...