sl23-n FORMOSA MICROSEMI CO. LTD, sl23-n Datasheet

no-image

sl23-n

Manufacturer Part Number
sl23-n
Description
Schottky Barrier Rectifier
Manufacturer
FORMOSA MICROSEMI CO. LTD
Datasheet
Low VF Chip Schottky Barrier Rectifier
SL22-N THRU SL24-N
List
List.................................................................................................
Package outline...............................................................................
Features..........................................................................................
Mechanical data...............................................................................
Maximum ratings .............................................................................
Rating and characteristic curves........................................................
Pinning information...........................................................................
Marking...........................................................................................
Suggested solder pad layout.............................................................
Packing information..........................................................................
Reel packing....................................................................................
Suggested thermal profiles for soldering processes.............................
High reliability test capabilities...........................................................
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID
DS-121656
Formosa MS
Issued Date
2008/02/10
Revised Date
-
Revision
A
Page.
7
1
2
2
2
2
3
4
4
4
5
6
6
7

Related parts for sl23-n

sl23-n Summary of contents

Page 1

Low VF Chip Schottky Barrier Rectifier SL22-N THRU SL24-N List List................................................................................................. Package outline............................................................................... Features.......................................................................................... Mechanical data............................................................................... Maximum ratings ............................................................................. Rating and characteristic curves........................................................ Pinning information........................................................................... Marking........................................................................................... Suggested solder pad layout............................................................. Packing information.......................................................................... Reel packing.................................................................................... Suggested thermal profiles for soldering processes............................. ...

Page 2

... DC reverse voltage Storage temperature I = 100mA F Storage temperature I = 500mA 2000mA SYMBOLS RMS RRM (V) (V) SL22 SL23 SL24 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Package outline 0.016(0.4) Typ. o CONDITIONS Operating *3 V temperature R ...

Page 3

Rating and characteristic curves (SL22-N THRU SL24-N) FIG.1-TYPICAL FORWARD CHARACTERISTICS 50 10 3.0 1 Pulse Width 300us 1% Duty Cycle 0.1 . 1.1 1.3 FORWARD VOLT AGE,(V) FIG.3 - TYPICAL REVERSE ...

Page 4

... Low VF Chip Schottky Barrier Rectifier SL22-N THRU SL24-N Pinning information Pin Pin1 cathode Pin2 anode Marking Type number SL22-N SL23-N SL24-N Suggested solder pad layout PACKAGE SOD-323 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Simplified outline 1 Marking code Dimensions in inches and (millimeters) ...

Page 5

Low VF Chip Schottky Barrier Rectifier SL22-N THRU SL24-N Packing information Item Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner ...

Page 6

Low VF Chip Schottky Barrier Rectifier SL22-N THRU SL24-N Reel packing COMPONENT PACKAGE REEL SIZE REEL SPACING (pcs) 7" 3000 SOD-323 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=10 C~35 C Humidity=65%±15% 2.Reflow soldering of surface-mount devices T P ...

Page 7

Low VF Chip Schottky Barrier Rectifier SL22-N THRU SL24-N High reliability test capabilities Item Test 1. Solder Resistance 2. Solderability 3. High Temperature Reverse Bias 4. Forward Operation Life 5. Intermittent Operation Life 6. Pressure Cooker 7. Temperature Cycling 8. ...

Related keywords