MC74HC374ADTG ON Semiconductor, MC74HC374ADTG Datasheet - Page 3

• Manufacturer Part Number: MC74HC374ADTG
• Description: IC FLIP FLOP OCTAL D 20-TSSOP
• Manufacturer: ON Semiconductor
• Series: 74HCr
• Type: D-Type Busr

Specifications of MC74HC374ADTG

• Function: Standard
• Output Type: Tri-State Non Inverted
• Number Of Elements: 1
• Number Of Bits Per Element: 8
• Frequency - Clock: 35MHz
• Delay Time - Propagation: 21ns
• Trigger Type: Positive Edge
• Current - Output High, Low: 7.8mA, 7.8mA
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress
ratings only. Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device
reliability.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D).
MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
DC ELECTRICAL CHARACTERISTICS
Symbol
Symbol
V
Symbol
in
V
V
V
V
V
T
t
I
I
V
V
P
V
T
, V
T
r
I
out
CC
CC
out
stg
CC
, t
OH
OL
in
IH
in
D
A
IL
L
f
out
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
DC Output Current, per Pin
DC Supply Current, V
Power Dissipation in Still Air,
Storage Temperature
Lead Temperature, 1 mm from Case for 10 Seconds
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
Operating Temperature, All Package Types
Input Rise and Fall Time
Minimum High−Level Input Voltage
Maximum Low−Level Input Voltage
Minimum High−Level Output
Voltage
Maximum Low−Level Output
Voltage
(Figure 1)
SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: − 6.1 mW/_C from 65_ to 125_C
(Plastic DIP, SOIC, SSOP or TSSOP Package)
Parameter
Parameter
Parameter
CC
and GND Pins
TSSOP Package†
(Voltages Referenced to GND)
SOIC Package†
V
|I
V
|I
V
|I
V
V
|I
V
out
out
out
out
out
out
in
in
in
in
Plastic DIP†
V
V
V
= V
= V
= V
= V
| v 20 mA
| v 20 mA
| v 20 mA
| v 20 mA
CC
CC
CC
= 0.1 V or V
= 0.1 V or V
IH
IH
IH
IH
= 2.0 V
= 4.5 V
= 6.0 V
Test Conditions
http://onsemi.com
or V
or V
or V
or V
IL
IL
IL
IL
CC
CC
– 0.5 to V
– 0.5 to V
3
– 55
Min
|I
|I
|I
|I
|I
|I
2.0
– 0.1 V
– 0.1 V
– 0.5 to + 7.0
– 65 to + 150
0
0
0
0
out
out
out
out
out
out
| v 2.4 mA
| v 6.0 mA
| v 7.8 mA
| v 2.4 mA
| v 6.0 mA
| v 7.8 mA
Value
± 20
± 35
± 75
750
500
450
260
CC
CC
+ 125
1000
Max
V
500
400
6.0
+ 0.5
+ 0.5
CC
V
2.0
3.0
4.5
6.0
2.0
3.0
4.5
6.0
2.0
4.5
6.0
3.0
4.5
6.0
2.0
4.5
6.0
3.0
4.5
6.0
Unit
Unit
mW
V
mA
mA
mA
CC
_C
_C
_C
ns
V
V
V
V
V
– 55 to
25_C
1.50
2.10
3.15
4.20
0.50
0.90
1.35
1.80
1.90
4.40
5.90
2.48
2.98
5.48
0.10
0.10
0.10
0.26
0.26
0.26
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance cir-
cuit. For proper operation, V
V
range GND v (V
tied to an appropriate logic voltage
level (e.g., either GND or V
Unused outputs must be left open.
out
This device contains protection
Unused inputs must always be
Guaranteed Limit
should be constrained to the
v 85_C
1.50
2.10
3.15
4.20
0.50
0.90
1.35
1.80
1.90
4.40
5.90
2.34
3.84
5.34
0.10
0.10
0.10
0.33
0.33
0.33
in
v 125_C
or V
1.50
2.10
3.15
4.20
0.50
0.90
1.35
1.80
1.90
4.40
5.90
2.20
3.70
5.20
0.10
0.10
0.10
0.40
0.40
0.40
out
) v V
in
CC
CC
and
Unit
V
V
V
V
V
V
.
).