ir3086mtr International Rectifier Corp., ir3086mtr Datasheet

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ir3086mtr

Manufacturer Part Number
ir3086mtr
Description
Xphasetm Phase Ic With Ovp, Fault And Overtemp Detect
Manufacturer
International Rectifier Corp.
Datasheet

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Part Number:
ir3086mtrPBF
Manufacturer:
IR
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20 000
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Page 1 of 34
The IR3086 Phase IC combined with an IR XPhase
implement power solutions for the latest high performance CPUs and ASICs. The “Control” IC provides
overall system control and interfaces with any number of “Phase” ICs which each drive and monitor a single
phase of a multiphase converter. The XPhase
expensive, and easier to design while providing higher efficiency than conventional approaches.
2.5A Average Gate Drive Current
Loss-Less Inductor Current Sense
Internal Inductor DCR Temperature Compensation
Programmable Phase Delay
Programmable Feed-Forward Voltage Mode PWM Ramp
Sub 100ns Minimum Pulse Width supports 1MHz per-phase operation
Current Sense Amplifier drives a single wire Average Current Share Bus
Current Share Amplifier reduces PWM Ramp slope to ensure sharing between phases
Body Braking
output voltage at converter turn-off
OVP comparator with 150ns response
Phase Fault Detection
Programmable Phase Over-Temperature Detection
Small thermally enhanced 20L MLPQ package
XPHASE
TM
TM
disables Synchronous MOSFET for improved transient response and prevents negative
PHASE IC WITH OVP, FAULT AND OVERTEMP DETECT
DESIGNS REPLACE WITH IR3086A
NOT RECOMMENDED FOR NEW
1
2
3
4
5
RMPIN+
RMPIN-
HOTSET
VRHOT
ISHARE
TM
IR3086
PHASE
IC
architecture results in a power supply that is smaller, less
TM
Control IC provides a full featured and flexible way to
GATEH
GATEL
VCCH
PGND
VCCL
15
14
13
12
11
Data Sheet No. PD94707
9/30
IR3086
/04

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ir3086mtr Summary of contents

Page 1

TM XPHASE PHASE IC WITH OVP, FAULT AND OVERTEMP DETECT DESCRIPTION The IR3086 Phase IC combined with an IR XPhase implement power solutions for the latest high performance CPUs and ASICs. The “Control” IC provides overall system control and interfaces ...

Page 2

... ORDERING INFORAMATION Device IR3086MTR * IR3086M • Samples only ABSOLUTE MAXIMUM RATINGS Operating Junction Temperature……………..150 Storage Temperature Range………………….-65 ESD Rating………………………………………HBM Class 1C JEDEC standard ...

Page 3

ELECTRICAL SPECIFICATIONS Unless otherwise specified, these specifications apply over: 8.4V ≤ ≤ 14V, and 0 C ≤ T CCL PARAMETER Gate Drivers GATEH Rise Time GATEH Fall Time GATEL Rise Time GATEL Fall Time GATEL low to ...

Page 4

PARAMETER PWM Comparator PWM Comparator Input Offset Voltage EAIN & PWMRMP Bias Current Clamp and Current Share Adjust OFF Propagation Delay VCCH = 12V. Measure time from Common Mode Input Range Exceeding the Common Mode input Share Adjust Error Amplifier ...

Page 5

PARAMETER General VCC Supply Current VCCL Supply Current VCCH Supply Current BIASIN Bias Current DACIN Bias Current Note 1: Guaranteed by design, but not tested in production PIN DESCRIPTION PIN# PIN SYMBOL PIN DESCRIPTION 1 RMPIN+ Non-inverting input to Ramp ...

Page 6

SYSTEM THEORY OF OPERATION TM XPhase Architecture TM The XPhase architecture is designed for multiphase interleaved buck converters which are used in applications requiring small size, design flexibility, low voltage, high current and fast transient response. The architecture can control ...

Page 7

PWM Control Method The PWM block diagram of the XPhase trailing edge modulation is used. A high-gain wide-bandwidth voltage type error amplifier in the Control IC is used for the voltage control loop. An external RC circuit connected to the ...

Page 8

VPEAK (5.0V) VPHASE4&5 (4.5V) VPHASE3&6 (3.5V) VPHASE2&7 (2.5V) VPHASE1&8 (1.5V) VVALLEY (1.00V) PWM Operation The PWM comparator is located in the Phase IC. Upon receiving a clock pulse, the PWM latch is set; the PWMRMP voltage begins to increase; the ...

Page 9

PHASE IC CLOCK PULSE EAIN PWMRMP VDAC GATEH GATEL STEADY-STATE OPERATION TM Body Braking In a conventional synchronous buck converter, the minimum time required to reduce the current in the inductor in response to a load step decrease is; The ...

Page 10

Figure 5. Inductor Current Sensing and Current Sense Amplifier The advantage of sensing the inductor current versus high side or low side sensing is that actual output current being delivered to the load is obtained rather than peak or sampled ...

Page 11

IR3086 THEORY OF OPERATION Block Diagram The Block diagram of the IR3086 is shown in Figure 6, and specific features are discussed in the following sections. RAMP COMPARATOR RMPIN+ CLOCK + PULSE RMPIN- - GENERATOR EAIN SYSTEM BIASIN BIASIN REFERENCE ...

Page 12

When designing for OVP the overall system must be considered. In many cases the over-current protection of the AC-DC or DC-DC converter supplying the multiphase converter will be triggered thus providing effective protection without damage as long as all PCB ...

Page 13

APPLICATION INFORMATION 12V RVCC 10 ohm CVCC RGATE 0.1uF 1nF 0.1uF ENABLE 1 21 OSCDS VBIAS VID5 2 20 VID5 BBFB VID0 3 IR3081 19 VID0 EAOUT VID1 4 CONTROL 18 VID1 FB IC VID2 5 17 VID2 VDRP VID3 ...

Page 14

DESIGN PROCEDURES - IR3081 AND IR3086 CHIPSET IR3081 EXTERNAL COMPONENTS Oscillator Resistor Rosc The oscillator of IR3081 generates a triangle waveform to synchronize the phase ICs, and the switching frequency of the each phase converter equals the oscillator frequency, which ...

Page 15

SR is proportional to that of VDAC down-slope and is given by Equation (9), where VDAC pin as shown in Figure15 of IR3081 Data Sheet. I SINK = C VDAC SR DOWN = + ...

Page 16

MAX = R FB ∗ DRP TM Body Braking Related Resistors R TM The body braking during Dynamic VID can be disabled by connecting BBFB pin to ground. If the feature is ...

Page 17

Over Temperature Setting Resistors R The threshold voltage of VRHOT comparator is proportional to the die temperature T the relationship between the die temperature of phase IC and the temperature of the power converter according to the power loss, PCB ...

Page 18

If the over temperature setting voltage is higher than the phase delay setting voltage, VBIAS*RA HOTSET pin between R and R PHASEx1 Pre-select R , PHASEx1 ( V HOTSET = R PHASEx PHASEx R PHASEx 3 Bootstrap ...

Page 19

∗ optional and may be needed in some applications to reduce the jitter caused by the high frequency ...

Page 20

π ∗ ∗ π ∗ π ∗ ∗ ...

Page 21

DESIGN EXAMPLE 1 - VRM 10 2U CONVERTER SPECIFICATIONS Input Voltage DAC Voltage: V =1.35 V DAC No Load Output Voltage Offset: V Output Current: I =105 ADC O Maximum Output Current: I =120 ADC OMAX ...

Page 22

VDAC Slew Rate Programming Capacitor C From Figure 15 of IR3081 Data Sheet, the sink current of VDAC pin corresponding to 400kHz (R 76uA. Calculate the VDAC down-slope slew-rate programming capacitor from the required down-slope slew rate. − ...

Page 23

Body Braking Related Resistors R N/A. The body braking during Dynamic VID is disabled. IR3086 EXTERNAL COMPONENTS PWM Ramp Resistor R and Capacitor C PWMRMP Set PWM ramp magnitude V PWMRMP resistor R , PWMRMP = R PWMRMP ∗ ∗ ...

Page 24

Bootstrap Capacitor C BST Choose C =0.1uF BST Decoupling Capacitors for Phase IC and Power Stage Choose C =0.1uF, C =0.1uF VCC VCCL VOLTAGE LOOP COMPENSATION Type II compensation is used for the converter with AL-Polymer output capacitors. Choose the ...

Page 25

DESIGN EXAMPLE 2 - EVRD 10 HIGH FREQUENCY ALL-CERAMIC CONVERTER SPECIFICATIONS Input Voltage DAC Voltage: V =1.3 V DAC No Load Output Voltage Offset: V Output Current: I =105 ADC O Maximum Output Current: I =120 ...

Page 26

VDAC Slew Rate Programming Capacitor C From Figure 15 of IR3081 Data Sheet, the sink current of VDAC pin corresponding to 800kHz (R 170uA. Calculate the VDAC down-slope slew-rate programming capacitor from the required down-slope slew rate. − ...

Page 27

Body Braking Related Resistors R N/A. The body braking during Dynamic VID is disabled. IR3086 EXTERNAL COMPONENTS PWM Ramp Resistor R and Capacitor C PWMRMP Set PWM ramp magnitude V PWMRMP resistor R , PWMRMP = R PWMRMP V * ...

Page 28

The over temperature setting voltage of Phases 3 and 4 is higher than the phase delay setting voltage, VBIAS*RA Pre-select R PHASEx. PHASEX1 − ∗ HOTSET PHASE 3 BIAS = R PHASE 32 − ...

Page 29

PWMRMP PWMRMP SW PWMRMP = F MI − − − PWMRMP DAC ...

Page 30

LAYOUT GUIDELINES The following layout guidelines are recommended to reduce the parasitic inductance and resistance of the PCB layout, therefore minimizing the noise coupled to the IC. • Dedicate at least one middle layer for a ground plane, which is ...

Page 31

PCB Metal and Component Placement • Lead land width should be equal to nominal part lead width. The minimum lead to lead spacing should be ≥ 0.2mm to minimize shorting. • Lead land length should be equal to maximum part ...

Page 32

Solder Resist • The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The solder resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are all Non ...

Page 33

Stencil Design • The stencil apertures for the lead lands should be approximately 80% of the area of the lead lands. Reducing the amount of solder deposited will minimize the occurrence of lead shorts. Since for 0.5mm pitch devices the ...

Page 34

PACKAGE INFORMATION 20L MLPQ ( Body) – θ IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 www.irf.com Page C/W, θ Data ...

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