irs2609d International Rectifier Corp., irs2609d Datasheet - Page 15

• Manufacturer Part Number: irs2609d
• Description: Half-bridge Driver
• Manufacturer: International Rectifier Corp.

IRS2609DSPbF
Figure 21: Antenna Loops
Supply Capacitor: It is recommended to place a bypass capacitor (C
) between the V
and COM pins. A ceramic 1 μF ceramic
IN
CC
capacitor is suitable for most applications. This component should be placed as close as possible to the pins in order to reduce
parasitic elements.
Routing and Placement: Power stage PCB parasitic elements can contribute to large negative voltage transients at the switch node;
it is recommended to limit the phase voltage negative transients. In order to avoid such conditions, it is recommended to 1) minimize
the high-side emitter to low-side collector distance, and 2) minimize the low-side emitter to negative bus rail stray inductance.
However, where negative V
spikes remain excessive, further steps may be taken to reduce the spike. This includes placing a
S
resistor (5 Ω or less) between the V
pin and the switch node (see Figure 22), and in some cases using a clamping diode between
S
COM and V
(see Figure 23). See DT04-4 at
www.irf.com
for more detailed information.
S
Figure 22: V
resistor
Figure 23: V
clamping diode
S
S
Additional Documentation
Several technical documents related to the use of HVICs are available at www.irf.com; use the Site Search function and the
document number to quickly locate them. Below is a short list of some of these documents.
DT97-3: Managing Transients in Control IC Driven Power Stages
AN-1123: Bootstrap Network Analysis: Focusing on the Integrated Bootstrap Functionality
DT04-4: Using Monolithic High Voltage Gate Drivers
AN-978: HV Floating MOS-Gate Driver ICs
www.irf.com
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