irs2608d International Rectifier Corp., irs2608d Datasheet - Page 16
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irs2608d
Manufacturer Part Number
irs2608d
Description
Half-bridge Driver
Manufacturer
International Rectifier Corp.
Datasheet
1.IRS2608D.pdf
(23 pages)
IRS2608DSPbF
Figure 19: Antenna Loops
Supply Capacitor: It is recommended to place a bypass capacitor (C
) between the V
and COM pins. A ceramic 1 μF
IN
CC
ceramic capacitor is suitable for most applications. This component should be placed as close as possible to the pins in
order to reduce parasitic elements.
Routing and Placement: Power stage PCB parasitic elements can contribute to large negative voltage transients at the
switch node; it is recommended to limit the phase voltage negative transients. In order to avoid such conditions, it is
recommended to 1) minimize the high-side emitter to low-side collector distance, and 2) minimize the low-side emitter to
negative bus rail stray inductance. However, where negative V
spikes remain excessive, further steps may be taken to
S
reduce the spike. This includes placing a resistor (5 Ω or less) between the V
pin and the switch node (see Figure 20),
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and in some cases using a clamping diode between COM and V
(see Figure 21). See DT04-4 at
www.irf.com
for more
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detailed information.
Figure 20: V
resistor
Figure 21: V
clamping diode
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Additional Documentation
Several technical documents related to the use of HVICs are available at www.irf.com; use the Site Search function
and the document number to quickly locate them. Below is a short list of some of these documents.
DT97-3: Managing Transients in Control IC Driven Power Stages
AN-1123: Bootstrap Network Analysis: Focusing on the Integrated Bootstrap Functionality
DT04-4: Using Monolithic High Voltage Gate Drivers
AN-978: HV Floating MOS-Gate Driver ICs
www.irf.com
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