unr-1.8/10-d3t Murata Manufacturing Co., Ltd, unr-1.8/10-d3t Datasheet - Page 6

• Manufacturer Part Number: unr-1.8/10-d3t
• Description: Single Output, Non-isolated, 3.3vin To 1.5/1.8/2.5vout 8 And 10 Amp Dc/dc Converters
• Manufacturer: Murata Manufacturing Co., Ltd

www.murata-ps.com
Recommended PC Board Layout
If necessary, a single pc board layout can accommodate both through-hole
and SMT models of the UNR D3 Series. Note that on page 2 of this data
sheet, the through-hole package is drawn with a bottom view of its pin
locations, and the surface-mount package is drawn with of top view of its
pin locations. As shown below, the through-hole pin locations, when viewed
from above, fall just inside (on 1.8 inch centers) the SMT pin locations (which
essentially begin on 2.1 inch centers). The table below shows how the pin
functions align.
ON/OFF CONTROL
(12.70)
0.500
0.100
(2.54)
0.300
(7.62)
0.300
(7.62)
Pin Number
Figure 5. Recommended Board Layout
3
SMT
4
2
1
PINS 1-2, 4: 0.040 ±0.002 (1.016 ±0.051)
PINS 3, 5-7: 0.062 ±0.002 (1.575 ±0.051)
4
3
2
1
9
8
7
6
5
2
1
Through-Hole
Case C16A2
Pin Number
GROUND
POWER
Case C18
TOP VIEW
TOP VIEW
(45.72)
No Pin
No Pin
1.800
2
1
7
6
5
4
3
On/Off Control
Output Return
Pin Function
Logic Ground
Input Return
+Output
+Input
7
6
5
4
3
N.C.
N.C.
Trim
9
8
6
7
5
4 EQ. SP. @
0.200 (5.08)
(20.32)
0.800
(2.54)
4 EQ. SP. @
0.200 (5.08)
+INPUT
+OUTPUT
0.10
TRIM
(2.54)
0.10
(20.32)
0.110
(2.79)
(2.54)
0.800
0.10
(25.40)
1.00
(25.40)
1.00
SMT Solder Process for SM models
For the surface-mount "SM" models of the UNR Series, the packages’ gull-
wing leads are made of tin-plated (150 microinches) copper. The gull-wing
configuration, as opposed to “J” leads, was selected to keep the solder joints
out from under the package to minimize both, heat conduction away from the
leads (into the encapsulated package) and shadowing effects.
"SM" modules do not currently withstand the standard solder-reflow process
with its most common temperature profiles. In order to avoid damage to the
converter a selective solder process (i.e. hot air gun or a hand soldering
method) with the following parameters must therefore be chosen :
Pre-heat phase 30-60°C rise/minute to 150°C maximum.
Lead temperature 300°C for 10 seconds maximum.
As shown in Figure 6, our tests have determined the optimal landing-pad size
to be 160 mils by 130 mils (4 x 3.3 mm).
Single Output, Non-Isolated, 3.3V
(0.38)
* PAD DIMENSION
** LEAD DIMENSION
0.015
Technical enquiries email: [e-mail], tel:
Figure 6 . PC Board Land Pattern
0.130*
(3.30)
0.100**
(2.54)
8 and 10 Amp DC/DC Converters
UNR D3 SERIES
0.160*
(4.06)
MDC_UNR15-25W Page 6 of 8
IN
to 1.5/1.8/2.5V
0.110**
(2.79)
[phone]
OUT