ltc2636-lz8 Linear Technology Corporation, ltc2636-lz8 Datasheet - Page 22

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ltc2636-lz8

Manufacturer Part Number
ltc2636-lz8
Description
Octal 12-/10-/8-bit Spi Vout Dacs With10ppm/?c Referenc
Manufacturer
Linear Technology Corporation
Datasheet
LTC2636
PACKAGE DESCRIPTION
22
3.60 ±0.05
(SEE NOTE 6)
2.20 ±0.05
TOP MARK
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1
0.200 REF
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
PACKAGE OUTLINE MO-229
TOP AND BOTTOM OF PACKAGE
1.70 ± 0.05
3.30 ±0.05
4.00 ±0.10
(2 SIDES)
3.00 REF
(Reference LTC DWG # 05-08-1708 Rev B)
14-Lead (4mm × 3mm) Plastic DFN
0.50 BSC
0.25 ± 0.05
3.00 ±0.10
0.75 ±0.05
(2 SIDES)
0.70 ±0.05
PACKAGE
OUTLINE
DE Package
0.00 – 0.05
R = 0.05
TYP
BOTTOM VIEW—EXPOSED PAD
7
1.70 ± 0.10
8
3.30 ±0.10
3.00 REF
R = 0.115
TYP
0.50 BSC
0.25 ± 0.05
14
1
0.40 ± 0.10
(DE14) DFN 0806 REV B
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45°
CHAMFER
2636f

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