mhw953 Freescale Semiconductor, Inc, mhw953 Datasheet - Page 5

• Manufacturer Part Number: mhw953
• Description: Uhf Power Amplifiers
• Manufacturer: Freescale Semiconductor, Inc

NOMINAL OPERATION
conditions of V s1 = V s2 = V s3 = 7.2 Vdc (Pins 2, 4, 5) and V b
= 5.0 Vdc (Pin 3) for MHW903/953. Nominal conditions are
V s1 = V s2 = 7.2 Vdc (Pins 2 and 4) and V b = 4.5 Vdc (Pin 3) for
MHW954. With these conditions, maximum current density on
any device is 1.5 x 10 5 A/cm 2 and maximum die temperature
is 165 C. While the modules are designed to have excess gain
margin with ruggedness, operation of these units outside the
published specifications is not recommended unless prior
communications regarding intended use have been made
with the factory representative.
GAIN CONTROL
value. The preferred method of power control for the
MHW903/953 is to fix V s1 = V s2 = V s3 = 7.2 Vdc, V b = 5.0 Vdc,
P in (Pin 1) at 1.0 mW, and vary V cont (Pin 1) voltage. For the
MHW954, fix V s1 = V s2 = 7.2 Vdc and V b = 4.5 Vdc; then vary
P in (Pin 1) to control P out (Pin 5).
DECOUPLING
limitation, external decoupling networks require careful con-
sideration, Pins 2, 3, 4 and 5 are internally bypassed with a
0.018 F chip capacitor which is effective for frequencies from
MOTOROLA RF DEVICE DATA
All electrical specifications are based on the nominal
The module output power should be limited to specified
Due to the high gain of the four stages and the module size
APPLICATIONS INFORMATION
5.0 MHz through 940 MHz. For bypassing frequencies below
5.0 MHz, networks equivalent to that shown in Figure 1 are
recommended. Inadequate decoupling will result in spurious
outputs at certain operating frequencies and certain phase
angles of input and output VSWR.
MOUNTING CONSIDERATIONS
accomplished by soldering the flange to a suitable heat sink.
This can be done with a low temperature solder such as 52%
In, 48% Sn and type “R” Flux which liquifies below 150 C.
Under no circumstances should the MHW903 Series modules
be heated to a temperature greater than 165 C. Internal
construction of the module has been achieved using 36% Tin,
62% lead, 2% silver solder which liquifies at 179– 180 C.
in a flux cleaning solution or other liquids under any
circumstances.
LOAD MISMATCH
fixture having the identical decoupling networks described in
Figure 1. Electrical conditions are V s1 = V s2 = V s3 = 9.0 Vdc
(Pins 2, 4, 5), and V b = 5.0 Vdc (Pin 3), P in = 2.0 mW (12.5%
duty cycle, 4.6 ms period), VSWR equal to 10:1, and output
power equal to 4.5 watts.
For the MHW903 Series module, mounting is generally
The modules are NOT hermetic. Do not immerse a module
During final test each module is load mismatch tested in a
MHW903 MHW953 MHW954
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