lmv1024 National Semiconductor Corporation, lmv1024 Datasheet - Page 17

• Manufacturer Part Number: lmv1024
• Description: Ic Pre Amp Mic Mono Ab Adc 6usmd
• Manufacturer: National Semiconductor Corporation

Physical Dimensions
inches (millimeters) unless otherwise noted
NOTE: UNLESS OTHERWISE SPECIFIED.
1. FOR SOLDER BUMP COMPOSITION, SEE “SOLDER INFORMATION” IN THE PACKAGING SECTION OF THE NATIONAL SEMICONDUCTOR WEB PAGE
(www.national.com).
2. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
3. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION.
4. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS PACK-
AGE HEIGHT.
5. NO JEDEC REGISTRATION AS OF MARCH 2003
6-Bump Ultra Thin micro SMD
NS Package Number URA06GGA
X
= 1.128 mm, X
= 1.628 mm, X
= 0.35 mm
1
2
3
17
www.national.com
201334 Version 3 Revision 4
Print Date/Time: 2009/07/20 17:12:49