MC14013BDG ON Semiconductor, MC14013BDG Datasheet - Page 8

IC FLIP FLOP DUAL D 14-SOIC

MC14013BDG

Manufacturer Part Number
MC14013BDG
Description
IC FLIP FLOP DUAL D 14-SOIC
Manufacturer
ON Semiconductor
Series
4000Br
Type
D-Typer
Datasheets

Specifications of MC14013BDG

Function
Set(Preset) and Reset
Output Type
Differential
Number Of Elements
2
Number Of Bits Per Element
1
Frequency - Clock
14MHz
Delay Time - Propagation
50ns
Trigger Type
Positive Edge
Voltage - Supply
3 V ~ 18 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Logic Family
4000
Technology
CMOS
Number Of Bits
2
Number Of Elements
2
Clock-edge Trigger Type
Positive-Edge
Polarity
Invert/Non-Invert
Operating Supply Voltage (typ)
3.3/5/9/12/15V
Package Type
SOIC
Propagation Delay Time
450ns
Low Level Output Current
4.2mA
High Level Output Current
-4.2mA
Frequency (max)
7MHz
Operating Supply Voltage (min)
3V
Operating Supply Voltage (max)
18V
Operating Temp Range
-55C to 125C
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
14
Circuit Type
Low-Power Schottky
Current, Supply
120 μA
Function Type
D-Type
Logic Function
Flip-Flop
Logic Type
CMOS
Number Of Circuits
Dual
Temperature, Operating, Range
-55 to +125 °C
Voltage, Supply
3 to 18 VDC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Output High, Low
-
Lead Free Status / Rohs Status
Compliant
Other names
MC14013BDG
MC14013BDGOS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC14013BDG
Manufacturer:
ON/安森美
Quantity:
20 000
Part Number:
MC14013BDGR
Manufacturer:
ON
Quantity:
1 615
−T−
0.15 (0.006) T
0.15 (0.006) T
0.10 (0.004)
SEATING
PLANE
L
U
U
PIN 1
IDENT.
2X
D
S
S
L/2
C
14
1
0.36
G
14X
14X
*For additional information on our Pb−Free strategy and soldering
−V−
A
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
K
0.10 (0.004)
REF
8
7
M
−U−
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
1
B
T
H
1.26
14X
U
http://onsemi.com
J J1
N
CASE 948G−01
S
N
TSSOP−14
DETAIL E
ISSUE B
V
7.06
S
DETAIL E
8
SECTION N−N
Ç Ç Ç
É É É
Ç Ç Ç
É É É
F
K1
K
0.25 (0.010)
M
DIMENSIONS: MILLIMETERS
−W−
NOTES:
0.65
PITCH
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
4. DIMENSION B DOES NOT INCLUDE
5. DIMENSION K DOES NOT INCLUDE
6. TERMINAL NUMBERS ARE SHOWN FOR
7. DIMENSION A AND B ARE TO BE
ANSI Y14.5M, 1982.
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
REFERENCE ONLY.
DETERMINED AT DATUM PLANE −W−.
DIM
K1
J1
A
B
C
D
G
H
K
M
F
J
L
MILLIMETERS
MIN
4.90
4.30
0.05
0.50
0.50
0.09
0.09
0.19
0.19
−−−
0
0.65 BSC
6.40 BSC
_
MAX
5.10
4.50
1.20
0.15
0.75
0.60
0.20
0.16
0.30
0.25
8
_
0.193
0.169
0.002
0.020
0.020
0.004
0.004
0.007
0.007
MIN
−−− 0.047
0.026 BSC
0.252 BSC
0
INCHES
_
0.200
0.177
0.006
0.030
0.024
0.008
0.006
0.012
0.010
MAX
8
_

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