tda8777hl/33/c1 NXP Semiconductors, tda8777hl/33/c1 Datasheet

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tda8777hl/33/c1

Manufacturer Part Number
tda8777hl/33/c1
Description
Triple 10-bit Video Dac, Up To 330 Mhz Sample Frequency
Manufacturer
NXP Semiconductors
Datasheet

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1. General description
2. Features
3. Applications
The TDA8777 consists of three separate 10-bit video Digital-to-Analog Converters (DACs)
with complementary outputs. They convert the digital input signals into analog current
outputs at a maximum conversion rate of 330 MHz.
The DACs are based on current source architecture.
A sync pulse can be added to the green signal (sync-on-green) to allow devices driven by
the video DAC to be synchronized.
The TDA8777 has a Power-down mode to reduce power consumption during inactive
periods.
The TDA8777 is fabricated in a CMOS process that ensures high functionality with low
power dissipation.
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TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
Rev. 04 — 11 April 2006
Triple 10-bit DAC
Sampling frequency up to 330 MHz
Internal voltage reference (1.21 V)
Complementary outputs
Direct drive of double terminated 75
TTL compatible input
Sync and blank control inputs
Analog output current source
Power-down mode
3.3 V power supply
LQFP48 package
PC video cards
High resolution image processing
Digital video systems
General purpose high-speed digital-to-analog conversion
load into standard level
Product data sheet

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tda8777hl/33/c1 Summary of contents

Page 1

TDA8777 Triple 10-bit video DAC 330 MHz sample frequency Rev. 04 — 11 April 2006 1. General description The TDA8777 consists of three separate 10-bit video Digital-to-Analog Converters (DACs) with complementary outputs. They convert the digital input signals ...

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... Quick reference data Parameter analog supply voltage analog supply current integral non-linearity differential non-linearity clock frequency TDA8777HL/14/C1 TDA8777HL/24/C1 TDA8777HL/33/C1 total power dissipation current in Power-down mode Ordering information Package Name Description plastic low profile quad flat package; 48 leads; body 7 Rev. 04 — 11 April 2006 ...

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Philips Semiconductors 6. Block diagram 30 V DDA3 29 V DDA2 13 V DDA1 48-39 10 red digital inputs (bits R9 to R0) 10-1 10 green digital inputs (bits G9 to G0) 23-14 10 blue digital inputs (bits B9 to ...

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Philips Semiconductors 7. Pinning information 7.1 Pinning Fig 2. Pin configuration 7.2 Pin description Table 3. Symbol BLANK SYNC V DDA1 TDA8777_4 Product data sheet Triple 10-bit ...

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Philips Semiconductors Table 3. Symbol CLK V SSA1 V SSA2 OUTB OUTB V DDA2 V DDA3 OUTG OUTG OUTR OUTR COMP VREF RSET PSAVE ...

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Philips Semiconductors An external reference resistor must be connected between pin RSET and analog ground. This resistor sets the reference current which determines the analog output level, and is specifi 560 . This value allows ...

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Philips Semiconductors 10. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter R thermal resistance from junction to ambient th(j-a) 11. Characteristics Table 6. Characteristics Typical values measured at V DDA Symbol Parameter Supplies V analog supply voltage DDA I analog ...

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Philips Semiconductors Table 6. Characteristics …continued Typical values measured at V DDA Symbol Parameter THD total harmonic distortion SFDR spurious-free dynamic range to Nyquist limit Outputs V output voltage compliance O(compl) C output capacitance OUT TDA8777_4 Product data sheet Triple ...

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... Philips Semiconductors Table 6. Characteristics …continued Typical values measured 3 DDA Symbol Parameter Timing f clock frequency CLK TDA8777HL/14/C1 TDA8777HL/24/C1 TDA8777HL/33/C1 t pipeline delay d(p) t input set-up time su(i) t input hold time h(i) t output delay time d(o) CLK Digital inputs ( B0, SYNC, BLANK) Analog outputs ...

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Philips Semiconductors 12. Application information 0 THD (dB Sampling frequency = 140 MHz. Fig 5. THD as a function of f OUT 0 THD (dB Sampling frequency = ...

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Philips Semiconductors 0 SFDR (dB Sampling frequency = 240 MHz Fig 9. SFDR as a function ...

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Philips Semiconductors 13. Package outline LQFP48: plastic low profile quad flat package; 48 leads; body 1 pin 1 index DIMENSIONS (mm are the original ...

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Philips Semiconductors 14. Soldering 14.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...

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Philips Semiconductors – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, ...

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Philips Semiconductors [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, ...

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Philips Semiconductors 15. Revision history Table 8. Revision history Document ID Release date TDA8777_4 20060411 • Modifications: Status changed to Product data sheet. • Characteristics table revised, see TDA8777_3 20050815 • Modifications: The format of this data sheet has been ...

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Philips Semiconductors 16. Legal information 16.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...

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Philips Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...

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