mc68hc711d3 Freescale Semiconductor, Inc, mc68hc711d3 Datasheet - Page 121
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mc68hc711d3
Manufacturer Part Number
mc68hc711d3
Description
M Hc11 Microcontrollers Microcontroller
Manufacturer
Freescale Semiconductor, Inc
Datasheet
1.MC68HC711D3.pdf
(138 pages)
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Chapter 10
Ordering Information and Mechanical Specifications
10.1 Introduction
This section provides ordering information for the MC68HC711D3. In addition, mechanical specifications
are provided for the following packaging options:
10.2 Ordering Information
10.3 40-Pin DIP (Case 711-03)
Freescale Semiconductor
•
•
•
1
40
40-pin plastic dual in-line package (DIP)
44-pin plastic leaded chip carrier (PLCC)
44-pin plastic quad flat pack (QFP)
H
40-pin DIP
44-pin PLCC
44-pin QFP
Package Type
G
A
F
–40 to +105°C
Temperature
–40 to +85°C
–40 to +85°C
–40 to +85°C
Table 10-1. MC Order Numbers
D
MC68HC711D3 Data Sheet, Rev. 2.1
21
20
SEATING
PLANE
N
K
B
MC68HC711D3CP2
MC68HC711D3CFN2
MC68HC711D3VFN2
MC68HC711D3CFB2
C
2 MHz
M
L
MC Order Number
J
NOTES:
1.
2.
3.
MC68HC711D3CP3
MC68HC711D3CFN3
MC68HC711D3VFN3
MC68HC711D3CFB3
POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
DIM
A
B
C
D
G
H
K
M
N
F
J
L
51.69
13.72
MILLIMETERS
MIN
3.94
0.36
1.02
1.65
0.20
2.92
0.51
15.24 BSC
2.54 BSC
3 MHz
0
°
52.45
14.22
MAX
5.08
0.56
1.52
2.16
0.38
3.43
1.02
15
°
2.035
0.540
0.155
0.014
0.040
0.065
0.008
0.115
0.020
MIN
0.100 BSC
0.600 BSC
0
INCHES
°
MAX
2.065
0.560
0.200
0.022
0.060
0.085
0.015
0.135
0.040
15
°
121