aic1750 Analog Intergrations Corporation, aic1750 Datasheet - Page 11

• Manufacturer Part Number: aic1750
• Description: Dual Output Low Esr Cap. Low-dropout 150ma Linear Regulator
• Manufacturer: Analog Intergrations Corporation

The AIC1750 is a low-dropout, low quiescent-current,
dual-output
applications. These parts are available with preset
output voltages ranging from 1.1V to 3.3V, and the
parts can supply loads up to 150mA.
SHUTDOWN
The AIC1750 has two independent shutdown control
inputs (EN1 and EN2). By connecting EN1 pin to
ground, output1 can be shut down. By connecting
EN2 pin to ground, output2 can be shut down. By
connecting both of EN1 pin and EN2 pin to ground,
the AIC1750 can be shut down to reduce the supply
current to 0.1µA.
CURRENT LIMIT
The AIC1750 includes two independent current
limiters, which monitor and control the maximum
output current. If the output is overloaded or shorted
to ground, this can protect the device from being
damaged.
THERMAL PROTECTION
The AIC1750 includes two independent thermal-
limiting circuits, which are designed to protect the
device against overload condition. When the junction
temperature exceeds T
circuit turns off the pass transistor and allows the IC to
cool. For continuous load condition, maximum rating
of junction temperature must not be exceeded.
INPUT-OUTPUT CAPACITORS
Linear regulators require input and output capacitors
to maintain stability. Input capacitor at 1µF with a 1µF
ceramic output capacitor for each regulator is
APPLICATION INFORMATION
linear
regulator
J
=150ºC, the thermal-limiting
for
battery
power
recommended.
recommended to follow the figure of “Region of
Stable C
capacitor specifications.
When choosing the input and output ceramic
capacitors, X5R and X7R types are recommended
because they retain their capacitance over wider
ranges of voltage and temperature than other types.
POWER DISSIPATION
The
depends on the thermal resistance of its case and
circuit board, the temperature difference between the
die junction and ambient air, and the rate of airflow.
The rate of temperature rise is greatly affected by the
mounting pad configuration on the PCB, the board
material, and the ambient temperature. When the IC
mounting with good thermal conductivity is used, the
junction temperature will be low even when large
power dissipation applies.
The power dissipation across the device is
P = I
The maximum power dissipation is:
Where T
temperature (125°C), and T
temperature suitable in application.
As a general rule, the lower temperature is, the better
reliability of the device is. So the PCB mounting pad
should provide maximum thermal conductivity to
maintain low device temperature.
P
MAX
OUT1
=
maximum
(T
OUT
(V
J-max
- J
max
Rθ
IN
ESR vs. Load Current” to choose proper
-V
JA
-
OUT1
is the maximum allowable junction
T
A
)
To
power
)+ I
OUT2
avoid
(V
dissipation
IN
-V
A
OUT2
oscillation,
is the ambient
)
AIC1750
of
AIC1750
it
is
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