mc33064dm ON Semiconductor, mc33064dm Datasheet - Page 10

• Manufacturer Part Number: mc33064dm
• Description: Undervoltage Sensing Circuit
• Manufacturer: ON Semiconductor

2X
2X
0.10
0.20
NOTE 5
0.05
L
T
T
H
1
5
A
2
G
4
3
*For additional information on our Pb−Free strategy and soldering
C
B
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
T
S
D
SEATING
PLANE
5X
0.20
0.039
1.0
0.037
C A B
PACKAGE DIMENSIONS
0.95
SOLDERING FOOTPRINT*
http://onsemi.com
CASE 483−02
J
SN SUFFIX
ISSUE H
TSOP−5
K
0.074
1.9
10
DETAIL Z
0.028
0.7
DETAIL Z
M
SCALE 10:1
0.094
2.4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. DIMENSIONS A AND B DO NOT INCLUDE
5. OPTIONAL CONSTRUCTION: AN
inches
ASME Y14.5M, 1994.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
mm
DIM
M
A
B
C
D
G
H
K
L
S
J
MILLIMETERS
MIN
0.90
0.25
0.01
0.10
0.20
1.25
2.50
3.00 BSC
1.50 BSC
0.95 BSC
0
_
MAX
1.10
0.50
0.10
0.26
0.60
1.55
10
3.00
_