mc33164dm-5 ON Semiconductor, mc33164dm-5 Datasheet - Page 11

• Manufacturer Part Number: mc33164dm-5
• Description: Micropower Undervoltage Sensing Circuits
• Manufacturer: ON Semiconductor

0.05 (0.002)
S
H
1
D
5
L
A
2
G
4
3
*For additional information on our Pb−Free strategy and soldering
C
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
B
MC34164, MC33164, NCV33164
K
0.039
1.0
0.037
PACKAGE DIMENSIONS
0.95
SOLDERING FOOTPRINT*
J
PLASTIC PACKAGE
http://onsemi.com
CASE 483−02
M
SN SUFFIX
ISSUE D
TSOP−5
0.074
1.9
11
0.028
0.7
SCALE 10:1
0.094
NOTES:
2.4
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. A AND B DIMENSIONS DO NOT INCLUDE
DIM
ANSI Y14.5M, 1982.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
A
B
C
D
G
H
K
M
J
L
S
0.013
MILLIMETERS
MIN
2.90
1.30
0.90
0.25
0.85
0.10
0.20
1.25
2.50
inches
mm
0
_
0.100
MAX
3.10
1.70
1.10
0.50
1.05
0.26
0.60
1.55
10
3.00
_
0.0512
0.0354
0.0098
0.0335
0.0005
0.0040
0.0079
0.0493
0.0985
0.1142
MIN
0
INCHES
_
0.1220
0.0669
0.0433
0.0197
0.0413
0.0040
0.0102
0.0236
0.0610
0.1181
MAX
10
_