mc33111p Lansdale Semiconductor, Inc., mc33111p Datasheet - Page 12
mc33111p
Manufacturer Part Number
mc33111p
Description
Low Voltage Compander
Manufacturer
Lansdale Semiconductor, Inc.
Datasheet
1.MC33111P.pdf
(12 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC33111P
Manufacturer:
MOTOROLA/摩托罗拉
Quantity:
20 000
ML33111
Page 12 of 12
Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliabil-
ity, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit
described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which
may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the cus-
tomer’s technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc.
SEATING
PLANE
-T-
16
1
1
H
G
-A-
G
D
16 PL
-A-
0.25 (0.010)
F
D
9
8
16 PL
0.25 (0.010)
M
S
9 1 6
8
B
K
T B
-B-
K
C
M
S
C
OUTLINE DIMENSIONS
-T-
P
T A
A
8 PL
www.lansdale.com
SEATING
PLANE
PLASTIC PACKAGE
S
PLASTIC PACKAGE
M
0.25 (0.010)
P DIP 16 = EP
CASE 648-08
CASE 751B-05
(ML33111EP)
(ML33111-5P)
SO 16 = -5P
M
J
M
R
X 45°
B
L
M
J
M
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
Y14.5M, 1982.
FORMED PARALLEL.
DIM
Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
A
B
C
D
G
H
K
M
S
DIM
F
J
L
LANSDALE Semiconductor, Inc.
G
M
A
B
C
D
F
J
K
P
R
0.740
0.250
0.145
0.015
0.040
0.008
0.110
0.295
0.020
MILLIMETERS
0.100 BSC
0.050 BSC
9.80
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
0°
INCHES
1.27 BSC
0°
0.770
0.270
0.175
0.021
0.070
0.015
0.130
0.305
0.040
10.00
10°
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
7°
MILLIMETERS
18.80
6.35
3.69
0.39
1.02
0.21
2.80
7.50
0.51
0.386
0.150
0.054
0.014
0.016
0.008
0.004
0.229
0.010
0°
0.050 BSC
2.54 BSC
1.27 BSC
0°
INCHES
19.55
6.85
4.44
0.53
1.77
0.38
3.30
7.74
1.01
10°
0.393
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
7°
Issue A