saf-xc2287-96fxxl Infineon Technologies Corporation, saf-xc2287-96fxxl Datasheet - Page 124

• Manufacturer Part Number: saf-xc2287-96fxxl
• Description: 16/32-bit Single-chip Microcontroller With 32-bit Performance
• Manufacturer: Infineon Technologies Corporation

5.2
When operating the XC228x in a system, the total heat generated in the chip must be
dissipated to the ambient environment to prevent overheating and the resulting thermal
damage.
The maximum heat that can be dissipated depends on the package and its integration
into the target board. The “Thermal resistance
power dissipation must be limited so that the average junction temperature does not
exceed 150 °C.
The difference between junction temperature and ambient temperature is determined by
∆T = (
The internal power consumption is defined as
P
The static external power consumption caused by the output drivers is defined as
P
The dynamic external power consumption caused by the output drivers (
on the capacitive load connected to the respective pins and their switching frequencies.
If the total power dissipation for a given system configuration exceeds the defined limit,
countermeasures must be taken to ensure proper system operation:
•
•
•
•
Data Sheet
INT
IOSTAT
Reduce
Reduce the system frequency
Reduce the number of output pins
Reduce the load on active output drivers
=
P
V
INT
= Σ((
DDP
+
Thermal Considerations
V
×
V
P
DDP
I
DDP
IOSTAT
DDP
, if possible in the system
-
V
(see
OH
+
) ×
P
Section
IODYN
I
OH
) + Σ(
) ×
R
4.2.3).
ΘJA
V
OL
×
I
OL
122
)
R
ΘJA
” quantifies these parameters. The
XC2000 Family Derivatives
XC2287 / XC2286 / XC2285
Package and Reliability
P
IODYN
V2.1, 2008-08
) depends