hsdl-3208 LiteOn Technology Corp., hsdl-3208 Datasheet
hsdl-3208
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hsdl-3208 Summary of contents
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... Ultra Small Profile Package IrDA® Data Compliant Low Power 115.2 kbit/s Infrared Transceiver Data Sheet Description The HSDL-3208 is an ultra-small low cost infrared transceiver module that provides the interface be- tween logic and infrared (IR) signals for through air, serial, half-duplex IR data link. The module is compli- ant to IrDA Physical Layer Specifications version 1 ...
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... F 20%, X7R Ceramic CX2 6.8 F 20%, Tantalum Notes: 8. CX1 must be placed within 0 the HSDL-3208 to obtain optimum noise immunity environments with noisy power supplies, supply rejection performance can be enhanced by including CX2, as shown in “Figure 1: HSDL-3208 Functional Block Diagram” in Page 1. 2 technical understanding associated with HSDL-3208 infrared transceiver module ...
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TX Power Mode Switching The transceiver is in default High TX Power Mode upon powered on. User needs to apply the following programming sequence to both SD and TXD inputs to switch the module to Low TX Power Mode. Both ...
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CAUTIONS: The BiCMOS inherent to the design of this component increases the component’s susceptibility to damage from the electrostatic discharge (ESD advised that normal static precautions be taken in handling and assembly of this component to prevent damage ...
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Electrical & Optical Specifications Specifications (Min. & Max. values) hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are with V 3.0 V ...
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V OH 90% 50% 10 Figure 5. RXD output waveform. TXD LED t pw (MAX.) Figure 7. TXD "stuck on" protection waveform. SD TXD TX LIGHT t TW Figure 9. TXD wakeup time waveform. ...
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... HSDL-3208 (Unshielded) Package Dimensions 2.80 3.50 7.00 ± 0.10 0.80 0.95 R 1.10 2.80 LED A LED C TXD RXD 0.95 (6X) 0.34 (5X) Figure 12. Package outline dimensions. (Unit: mm, Tolerance: 0.2 mm) 7 0.80 MOUNTING CENTER 1.60 ± 0.10 5.10 0. GND CC 0.60 (7X) 0.40 (2X) 1.60 0.80 ...
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... HSDL-3208 (Unshielded) Tape and Reel Dimensions UNIT: mm POLARITY PIN 7: GND PIN 1: LED A 2.93 ± 0.1 0.3 ± 0.05 1.78 ± 0.1 EMPTY (40 mm MIN.) LABEL Figure 13. Tape and reel dimensions. 8 4.0 ± 0.1 1.75 ± 0.1 + 0.1 1.5 2.0 ± 0.1 0 7.5 ± 0.1 7.35 ± 0.1 4.0 ± 0.1 PROGRESSIVE DIRECTION PARTS MOUNTED LEADER (400 mm MIN.) EMPTY (40 mm MIN.) OPTION # "B" "C" QUANTITY ...
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... HSDL-3208 (Shielded) Package Dimensions 1. Unless otherwise stated, dimension tolerance: 0.2 mm. 2. Castellation length, mentioned below, is the minimum value i.e., 0.6 mm. The specification is: 0.63 0.03 mm. MOUNTING CENTER 1.80 0.05 0.95 2.9 +0.02 0.15 –0.01 Figure 14a. Package outline dimensions. 9 3.7 7.40 0.10 +0.03 7.00 –0.00 2.5 2.0 0.95 0.95 5.1 R1.1 EMITTER RECEIVER 6.96 0.64 0.95 0.6 0.63 0.99 0.8 COPLANARITY = –0 0.0 mm 0.6 1.6 1.97 0.2 0.03 ...
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... HSDL-3208 (Shielded) Tape Dimensions 0. (MAX.) A-A SECTION UNIT: mm SYMBOL Ao SPEC 3.15 0.10 7.70 SYMBOL E SPEC 1.75 0.10 7.50 PS Figure 15. Tape dimensions. 10 2.0 0. 0.10 1.95 0.10 4.00 0.10 8.00 0. 0.10 1.55 0.05 1.50 0.10 16.00 0.30 40.00 +0.5 n 13.1 – (MAX 2.35 0.10 0.30 0.10 10Po 0.20 +0.5 16 –0 +0.1 62.3 –0.1 +0.1 2.6 –0.1 ...
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... Moisture Proof Packaging All HSDL-3208 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 4. UNITS IN A SEALED MOISTURE-PROOF OPENED (UNSEALED) NO BAKING YES IS NECESSARY PERFORM RECOMMENDED BAKING CONDITIONS Figure 16. Baking conditions chart. 11 PACKAGE PACKAGE IS ENVIRONMENT LESS THAN 30° ...
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... The cool down rate, R5, from the liquidus point of the solder (77 F) should not exceed 6 C per second maximum. This limitation is necessary to allow the PC board and HSDL-3208 castellation I/O pins to change dimensions evenly, putting minimal stresses on the HSDL- 3208 transceiver. ...
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... HSDL-3208 (Unshielded) 1.0 Solder Pad, Mask and Metal Stencil Aperture STENCIL APERTURE SOLDER MASK Figure 18. Stencil and PCBA. 1.1 Recommended Land Pattern MOUNTING CENTER 0.10 1.75 0.60 UNIT: mm Figure 19. Stencil and PCBA. 13 METAL STENCIL FOR SOLDER PASTE PRINTING LAND PATTERN PCBA C L 0.775 FIDUCIAL 0.95 1.9 2.85 ...
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Recommended Metal Solder Stencil Aperture It is recommended that only a 0.152 mm (0.006 inches 0.127 mm (0.005 inches) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and ...
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... Appendix A : SMT Assembly Application Note HSDL-3208 (Shielded) 2.0 Solder Pad, Mask and Metal Stencil Aperture STENCIL APERTURE SOLDER MASK Figure 22. Stencil and PCBA. 2.1 Recommended Land Pattern SHIELD SOLDER PAD MOUNTING 0.20 CENTER 1.45 0.60 UNIT: mm Figure 23. Land Pattern. 15 METAL STENCIL FOR SOLDER PASTE PRINTING LAND ...
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Recommended Metal Solder Stencil Aperture It is recommended that only a 0.152 mm (0.006 inches 0.127 mm (0.005 inches) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and ...
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... Appendix B: PCB Layout Suggestion The HSDL-3208 is a shieldless part and hence does not contain a shield trace, unlike the other transceivers. The following PCB layout guide- lines should be followed to obtain a good PSRR and EM immunity, resulting in good electrical performance. Things to note: 1. The AGND pin should be connected to the ground plane ...
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... V AUDIO INTERFACE DSP CORE RF INTERFACE MICROCONTROLLER USER INTERFACE Interface to Recommended I/O Chips The HSDL-3208’s TXD data input is buffered to allow for CMOS drive levels. No peaking circuit or capacitor is required. Data rate from 9.6 kb 115.2 kb/s is available at the RXD pin. The diagram below shows how ...
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... RAM ROM PCMCIA CONTROLLER Figure 28. IR layout in PDA platform. The link distance testing is done using typical HSDL-3208 units with National Semiconductor’s PC87109 3V Super I/O Controller and SMC’s FDC37C669 and FDC37N769 Super I/O controllers. An 115.2 kb/s datarate IR link distance has been demonstrated. ...
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... MATERIAL Y IR TRANSPARENT WINDOW Figure 29. Window design diagram. 20 from the HSDL-3208 to the back of the window. The distance from the center of the LED lens to the center of the photodiode lens 5.1 mm. The equations for computing the window dimensions are as follows ...
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Module Depth Aperture Width (x, mm) (z) mm Max. 0 8.76 1 9.92 2 11.07 3 12.22 4 13.38 5 14.53 6 15.69 7 16.84 8 18.00 9 19.15 APERTURE WIDTH (X) vs. MODULE DEPTH ...
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Window Material Almost any plastic material will work as a window material. Polycarbonate is recommended. The surface finish of the plastic should be smooth, without any texture filter dye may be used in the window to make it ...
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For company and product information, please go to our web site: http://optodatabook.liteon.com/databook/databook.aspx Data subject to change. Copyright © 2007 Lite-On Technology Corporation. All rights reserved. 23 WWW.liteon.com or ...