jlc1562be ON Semiconductor, jlc1562be Datasheet - Page 8

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jlc1562be

Manufacturer Part Number
jlc1562be
Description
I2c Bus I/o Expander
Manufacturer
ON Semiconductor
Datasheet
e
16
1
16
1
0.13 (0.005)
H
Z
b
−A−
G
D
M
F
D
9
8
16 PL
9
8
0.25 (0.010)
B
A
S
E
0.10 (0.004)
A
H
1
E
K
C
M
VIEW P
−T−
T
A
SEATING
PLANE
PACKAGE DIMENSIONS
M
M
_
http://onsemi.com
L
E
CASE 648−08
J
CASE 966−01
JLC1562B
SOEIAJ−16
N SUFFIX
PDIP−16
ISSUE T
ISSUE A
L
DETAIL P
8
L
Q
M
1
c
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
4. DIMENSION B DOES NOT INCLUDE
5. ROUNDED CORNERS OPTIONAL.
NOTES:
ANSI Y14.5M, 1982.
WHEN FORMED PARALLEL.
MOLD FLASH.
DIM
A
B
C
D
G
H
K
M
F
J
L
S
1.
2.
3.
4.
5.
Y14.5M, 1982.
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
REFERENCE ONLY.
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
H
DIM
A
M
A
b
D
E
L
L
Q
Z
c
e
E
1
E
DIMENSIONING AND TOLERANCING PER ANSI
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS D AND E DO NOT INCLUDE
TERMINAL NUMBERS ARE SHOWN FOR
THE LEAD WIDTH DIMENSION (b) DOES NOT
0.740
0.250
0.145
0.015
0.040
0.008
0.295
0.020
1
0.110
MIN
0.100 BSC
0.050 BSC
0
INCHES
MILLIMETERS
_
MIN
0.05
0.35
0.10
9.90
5.10
7.40
0.50
0.70
1.10
−−−
−−−
0
1.27 BSC
_
0.770
0.270
0.175
0.021
0.015
0.130
0.305
0.040
MAX
0.70
10
10.50
MAX
10
2.05
0.20
0.50
0.20
5.45
8.20
0.85
1.50
0.90
0.78
_
_
18.80
MILLIMETERS
6.35
3.69
0.39
1.02
0.21
2.80
7.50
0.51
MIN
0.002
0.014
0.007
0.390
0.201
0.291
0.020
0.043
0.028
2.54 BSC
1.27 BSC
0
MIN
−−−
−−−
0
0.050 BSC
_
INCHES
_
19.55
MAX
6.85
4.44
0.53
1.77
0.38
3.30
7.74
1.01
0.081
0.008
0.020
0.413
0.215
0.323
0.033
0.059
0.035
0.031
10
MAX
0.011
10
_
_

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