lx7206 Microsemi Corporation, lx7206 Datasheet - Page 3

• Manufacturer Part Number: lx7206
• Description: Integrated Emi Filter & Esd Protection For Earpiece Speaker & Microphone Ports
• Manufacturer: Microsemi Corporation

Copyright ¤ 2004
Rev. 1.0, 2004-10-05
Figure 2 – Solder Reflow Profile. Maximum temperature is 240° C and maximum time above liquidous (183° C) is 60
Cu pad size
Pad Pitch
Pad Definition
Solder Mask Opening
Solder Stencil
Pad Protective Finish
TM
seconds.
240
o
C max
183
150
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: [phone]
o
o
C
C
Parameter
Preheat Zone
Figure 1 – Recommended Non-Solder Mask Defined Pad
~ 1min
R E C O M M E N D E D P C B P A R A M E T E R S
Integrated Products Division
®
Microsemi
Flux Activation
~2 min
Zone
Non-Solder Mask Defined Cu
Integrated EMI Filter & ESD Protection for
Earpiece Speaker & Microphone Ports
Pad (OSP finish)
0.275 mm dia.
0.275 +0.0/-0.025 mm
0.5mm
Non-Solder Mask Defined
0.325 ± 0.025 mm
0.25 x 0.25 mm square,
0.125 mm thick, laser cut, electro-polished
OSP (Organic Surface Preservative)
Solder Mask Opening
0.325 mm dia.
P
Solder Reflow
RODUCTION
~ 1min
Zone
D
Value
ATA
Cooling Zone
Time (s)
S
HEET
LX7206
Page 3