mk50n512cmc100 Freescale Semiconductor, Inc, mk50n512cmc100 Datasheet - Page 20

• Manufacturer Part Number: mk50n512cmc100
• Description: Arm Cortex-m4 Core With Dsp K50 Sub-family Data Sheet
• Manufacturer: Freescale Semiconductor, Inc

Peripheral operating requirements and behaviors
4. 15pF load
5.3 Thermal specifications
5.3.1 Thermal operating requirements
5.3.2 Thermal attributes
1.
6 Peripheral operating requirements and behaviors
All digital I/O switching characteristics assume:
20
Single-layer
(1s)
Four-layer
(2s2p)
Single-layer
(1s)
Four-layer
(2s2p)
—
—
—
1. output pins
Board
Symbol
type
T
T
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
J
A
• have C
• are configured for fast slew rate (PORTx_PCRn[SRE]=0), and
• are configured for high drive strength (PORTx_PCRn[DSE]=1)
R
R
R
R
R
R
Ψ
Symbol
Die junction temperature
Ambient temperature
θJA
θJA
θJMA
θJMA
θJB
θJC
Description
JT
L
=30pF loads,
Thermal resistance, junction to ambient (natural
convection)
Thermal resistance, junction to ambient (natural
convection)
Thermal resistance, junction to ambient (200 ft./min.
air speed)
Thermal resistance, junction to ambient (200 ft./min.
air speed)
Thermal resistance, junction to board
Thermal resistance, junction to case
Thermal characterization parameter, junction to
package top outside center (natural convection)
Description
K50 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
Table 9. Thermal operating requirements
Preliminary
Min.
–40
–40
TBD
TBD
TBD
TBD
TBD
TBD
TBD
MAPBGA
121
Freescale Semiconductor, Inc.
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Max.
125
85
1
1
1
1
2
3
4
Notes
Unit
°C
°C