peb4264 Infineon Technologies Corporation, peb4264 Datasheet - Page 38

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peb4264

Manufacturer Part Number
peb4264
Description
Peb4264 Subscriber Line Interface Circuit Standard Feature Set
Manufacturer
Infineon Technologies Corporation
Datasheet

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6.3.1
The heatslug is soldered to the PCB according to
another PCB metal layer as an additional cooling area is recommended. These copper areas should be both
electrically separated from each other and floating, i. e. they must not be connected with any other metallic part
on the PCB.
Figure 26
Preliminary Data Sheet
Recommended PCB Foot Print Pattern for PG-DSO-36-15 Package
Footprint for PG-DSO-36-15
1 .8 3
F lash A u re co m m end ed, free o f solder re sist
C u laye r w ith solde r resist coa tin g
V ia hole
Figure
1 3 .4 8
9 .5
5 .9
3 .2
38
25. For improved thermal behaviour the utilization of
H e a tslu g o u tlin e
P a cka g e o u tlin e
PEF 4264 / PEF 4364
Revision 2.0, 2006-10-10
SLIC-S / TSLIC-S
Package Outlines

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