ncp2890-d ON Semiconductor, ncp2890-d Datasheet
![no-image](/images/manufacturer_photos/0/4/495/on_semiconductor_sml.jpg)
ncp2890-d
Related parts for ncp2890-d
ncp2890-d Summary of contents
Page 1
... The NCP2890 is an audio power amplifier designed for portable communication device applications such as mobile phone applications. The NCP2890 is capable of delivering 1 continuous average power to an 8.0 W BTL load from a 5.0 V power supply, and 320 4.0 W BTL load from a 2.6 V power supply. ...
Page 2
... Ri − 390 BYPASS bypass SHUTDOWN VIH VIL Figure 2. Typical Audio Amplifier Application Circuit with a Differential Input This device contains 671 active transistors and 1899 MOS gates. NCP2890, NCV2890 − OUTA + ...
Page 3
... Negative input of the first amplifier, receives the audio input signal. Connected to the feedback resistor R and to the input resistor R f OUTA Negative output of the NCP2890. Connected to the load and to the feedback resistor Rf. INP Positive input of the first amplifier, receives the common mode voltage. VM_P Power Analog Ground ...
Page 4
... This parameter is not tested in production for 9−Pin Flip−Chip CSP package in case of a 5.0 V power supply. 8. See page 11 for a theoretical approach of this parameter. 9. For this parameter, the Min/Max values are given for information. NCP2890, NCV2890 between −40°C to +85°C (Unless otherwise noted). A ...
Page 5
... FREQUENCY (Hz) Figure 3. THD + N versus Frequency 2 100 mW out 0.1 0.01 0.001 10 100 1000 FREQUENCY (Hz) Figure 5. THD + N versus Frequency NCP2890, NCV2890 1 0.1 0.01 0.001 10,000 100,000 10 Figure 2. THD + N versus Frequency 1 0.1 0.01 0.001 10,000 100,000 10 Figure 4. THD + N versus Frequency ...
Page 6
... Figure 9. THD + N versus Power Out 1700 kHz 1500 = 1300 THD+N = 10% 1100 900 700 500 300 100 2.0 2.5 3.0 3.5 POWER SUPPLY (V) Figure 11. Output Power versus Power Supply NCP2890, NCV2890 10 1 0.1 0.01 0.001 400 500 600 0 Figure 8. THD + N versus Power Out kHz 1 A 0.1 0.01 300 400 0 Figure 10 ...
Page 7
... 200 mV ripple pk−pk − bypass −60 −70 −80 −90 −100 10 100 1000 FREQUENCY (Hz) Figure 17 SRR NCP2890, NCV2890 −25 −30 −35 −40 −45 −50 −55 −60 −65 10,000 100,000 −30 −35 −40 −45 −50 −55 −60 − ...
Page 8
... 200 mV ripple pk−pk − bypass −60 −70 −80 −90 −100 10 100 1000 FREQUENCY (Hz) Figure 23 SRR p NCP2890, NCV2890 −30 −35 −40 −45 −50 −55 −60 −65 −70 −75 10 10,000 100,000 = −30 −35 −40 −45 −50 −55 −60 − ...
Page 9
... DC OUTPUT VOLTAGE (V) Figure 27 Output Voltage SRR Figure 29. Turning On Time − V NCP2890, NCV2890 0 −10 −20 −30 −40 −50 −60 −70 −80 10,000 100,000 −5 −4 − Figure 26. P ...
Page 10
... P = 633 mW Dmax 100 for 100 T , AMBIENT TEMPERATURE (°C) A Figure 35. Power Derating − 9−Pin Flip−Chip CSP NCP2890, NCV2890 0.3 0.25 0.2 0.15 0.1 0. 1.2 0 0.1 Figure 32. Power Dissipation versus Output 0.4 0.35 R 0.3 0.25 0.2 0.15 0.1 0.05 0 0.3 0.4 0 0.05 0.1 Figure 34. Power Dissipation versus Output ...
Page 11
... Detailed Description The NCP2890 audio amplifier can operate under 2.6 V until 5.5 V power supply. It delivers 320 mW rms output power to 4.0 W load (V = 2.6 V) and 1.0 W rms output p power to 8.0 W load (V = 5.0 V). p The structure of the NCP2890 is basically composed of two identical internal power amplifiers; the first one is externally configurable with gain− ...
Page 12
... In order to optimize device and system performance, the NCP2890 should be used in low gain configurations. The low gain configuration minimizes THD + noise values and maximizes the signal to noise ratio, and the amplifier can still be used without running into the bandwidth limitations ...
Page 13
... NCP2890, NCV2890 Silkscreen Layer Top Layer Figure 38. Demonstration Board for 9−Pin Flip−Chip CSP Device − PCB Layers http://onsemi.com Bottom Layer 13 ...
Page 14
... NOTE: This product is offered with either eutectic (SnPb−tin/lead) or lead−free solder bumps (G suffix) depending on the PCB assembly process. The NCP2890AFCT2G version requires a lead−free solder paste and should not be used with a SnPb solder paste. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D ...
Page 15
... NCP2890, NCV2890 PACKAGE DIMENSIONS −A− 0.10 C −B− E TOP VIEW A 0.10 C 0.05 C −C− A2 SEATING A1 PLANE SIDE VIEW 0. 0.03 C BOTTOM VIEW SOLDERING FOOTPRINT* 0.265 0.01 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D ...
Page 16
... Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com NCP2890, NCV2890 PACKAGE DIMENSIONS Micro8t CASE 846A−02 ISSUE G NOTES: 1 ...