lt5512 Linear Technology Corporation, lt5512 Datasheet - Page 11

• Manufacturer Part Number: lt5512
• Description: 1khz-3ghz High Signal Level Active Mixer
• Manufacturer: Linear Technology Corporation

PACKAGE DESCRIPTIO
4.35 ± 0.05
2.90 ± 0.05
2.15 ± 0.05
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGC)
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PIN 1
U
4.00 ± 0.10
(4 SIDES)
16-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1692)
0.65 BCS
0.30 ±0.05
UF Package
0.72 ±0.05
PACKAGE OUTLINE
0.75 ± 0.05
0.200 REF
0.00 – 0.05
2.15 ± 0.10
(4-SIDES)
R = 0.115
BOTTOM VIEW—EXPOSED PAD
TYP
15
16
0.65 BSC
0.30 ± 0.05
LT5512
0.55 ± 0.20
1
2
(UF) QFN 0102
11
5512fa