cgy196 ETC-unknow, cgy196 Datasheet - Page 14

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cgy196

Manufacturer Part Number
cgy196
Description
Gaas Mmic Broadband Power Amplifier 800.3500 Dect/phs/pcs/gsm/amps/wlan/wll Single Voltage Supply
Manufacturer
ETC-unknow
Datasheet
Semiconductor Group
Preliminary soldering recommendation
Siemens Aktiengesellschaft
Type
Key-word
S I E M E N S
Notes on Processing
CGY196
Foot Print
Soldering
Solder paste thickness
Control of soldering (voids)
Jedec A-112A
IPC-9501 (IPC-4202)
soldering profile:
ramp-up preheating
ramp-up peak
exposure to molten solder
typ. solder temperature
peak temperature
ramp-down
comments
GaAs MMIC
Package
SCT598
High Frequency Semiconductors
drawing C63060-A2123-A001-01-0027
wave soldering:
reflow soldering:
(IR or VPR)
temperature gradient:
time at 100 - 150 °C:
temperature gradient
above 183°C
typ. 215-245°C
max. peak 260°C
temperature gradient:
(see also soldering standard profile of databook
‘package information’)
slow ramp-up, long preheating phase and low max.
temperature recommended
150 - 200 µm
- visual inspection
- cross sectioning
- measurement of case temperature /
level 1
level 111
thermal resistance case to ambient
14
14
File
D:\Projekte\AKTUELL\EH_DB\lie
ferung_pdf\Lieferung\word\cgy19
storage floor life at 30°C/90% unlimited
storage floor life at 30°C/60% unlimited
IR/Convection; max. 245°C; < 6K/sec.
unsuitable
suitable
max. + 2 K/sec
min. 90 sec.
max. + 6 K/sec
max. 150 sec
max. 30 sec.
max. 10 sec.
min. - 6°C/sec
Date
26.02.1998
HL HF PE GaAs
CGY 196
1998-11-01
16.6.1998

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